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Tin Sputtering Target

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Properties common to all products in this list

Composition: Sn Form: Sputtering Target Material: Tin CAS Number: 7440-31-5 Commodity: Metals Purity: 99.99%
Tin Sputtering Target is a precisely manufactured form optimized for thin-film deposition via physical vapor deposition (PVD) processes. With excellent corrosion resistance, good adhesion properties, and compatibility with a variety of substrates, tin targets are widely used in microelectronics, optics, and surface engineering. Industries including semiconductor manufacturing, photovoltaics, and packaging use tin sputtering targets to deposit protective layers, conductive coatings, and solderable surfaces. Specific applications include creating tin-based conductive films for touchscreens, forming corrosion-resistant layers on optical components, and producing barrier coatings for flexible electronics. The high purity and density of the target ensure consistent sputtering rates and film uniformity, making it critical for both research and high-specification industrial production.
Starting at $194.00 each
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Material Properties

Atomic Properties
Element Value
Atomic number 50
Crystal structure Tetragonal
Electronic structure Kr 4d¹⁰ 5s² 5p²
Valences shown 2,4
Atomic weight( amu ) 118.69
Thermal neutron absorption cross-section( Barns ) 0.63
Photo-electric work function( eV ) 4.3
Natural isotope distribution( Mass No./% ) 122/ 4.6
Natural isotope distribution( Mass No./% ) 124/ 5.6
Natural isotope distribution( Mass No./% ) 114/ 0.7
Natural isotope distribution( Mass No./% ) 120/ 32.4
Natural isotope distribution( Mass No./% ) 118/ 24.3
Natural isotope distribution( Mass No./% ) 112/ 1.0
Natural isotope distribution( Mass No./% ) 116/ 14.7
Natural isotope distribution( Mass No./% ) 115/ 0.4
Natural isotope distribution( Mass No./% ) 117/ 7.7
Natural isotope distribution( Mass No./% ) 119/ 8.6
Atomic radius - Goldschmidt( nm ) 0.158
Ionisation potential( No./eV ) 2/ 14.63
Ionisation potential( No./eV ) 5/ 72.3
Ionisation potential( No./eV ) 3/ 30.5
Ionisation potential( No./eV ) 4/ 40.7
Ionisation potential( No./eV ) 1/ 7.34
Mechanical Properties
Element Value
Hardness - Mohs 1.5-1.8
Material condition Polycrystalline
Poisson's ratio 0.357
Bulk modulus( GPa ) 58.2
Tensile modulus( GPa ) 49.9
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 12.6@20°C
Superconductivity critical temperature( K ) 3.722
Temperature coefficient( K⁻¹ ) 0.0046@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) 0.42
Physical Properties
Element Value
Boiling point( C ) 2270
Density( gcm⁻³ ) 7.28@20°C
Thermal Properties
Element Value
Melting point( C ) 231.9
Latent heat of evaporation( J g⁻¹ ) 2497
Latent heat of fusion( J g⁻¹ ) 59.6
Specific heat( J K⁻¹ kg⁻¹ ) 213@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 66.8@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 23.5@0-100°C
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Available Configurations

Properties common to all products in this list

Composition: Sn Form: Sputtering Target Material: Tin CAS Number: 7440-31-5 Commodity: Metals Purity: 99.99%

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