Tin Sputtering Target

Tin Sputtering Targets are a new product in our extensive range of sputtering target materials. With 5 variations available, these high purity tin disks are ideal for use as sputtering targets in the production of thin films and coatings. Example applications include creating transparent conductive coatings for touch screens and low-emissivity window coatings, as well as barrier layers in food and beverage packaging to improve shelf life. These disks are available in multiple sizes and orientations to suit different sputtering system requirements.

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Properties

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Material Properties for Metals

Atomic Properties

Element	Value
Atomic number	50
Crystal structure	Tetragonal
Electronic structure	Kr 4d¹⁰ 5s² 5p²
Valences shown	2,4
Atomic weight( amu )	118.69
Thermal neutron absorption cross-section( Barns )	0.63
Photo-electric work function( eV )	4.3
Natural isotope distribution( Mass No./% )	122/ 4.6
Natural isotope distribution( Mass No./% )	124/ 5.6
Natural isotope distribution( Mass No./% )	114/ 0.7
Natural isotope distribution( Mass No./% )	120/ 32.4
Natural isotope distribution( Mass No./% )	118/ 24.3
Natural isotope distribution( Mass No./% )	112/ 1.0
Natural isotope distribution( Mass No./% )	116/ 14.7
Natural isotope distribution( Mass No./% )	115/ 0.4
Natural isotope distribution( Mass No./% )	117/ 7.7
Natural isotope distribution( Mass No./% )	119/ 8.6
Atomic radius - Goldschmidt( nm )	0.158
Ionisation potential( No./eV )	2/ 14.63
Ionisation potential( No./eV )	5/ 72.3
Ionisation potential( No./eV )	3/ 30.5
Ionisation potential( No./eV )	4/ 40.7
Ionisation potential( No./eV )	1/ 7.34

Mechanical Properties

Element	Value
Hardness - Mohs	1.5-1.8
Material condition	Polycrystalline
Poisson's ratio	0.357
Bulk modulus( GPa )	58.2
Tensile modulus( GPa )	49.9

Electrical Properties

Element	Value
Electrical resistivity( µOhmcm )	12.6@20@20°C
Superconductivity critical temperature( K )	3.722
Temperature coefficient( K⁻¹ )	0.0046@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV )	0.42

Physical Properties

Element	Value
Boiling point( C )	2270
Density( gcm⁻³ )	7.28@20°C

Thermal Properties

Element	Value
Melting point( C )	231.9
Latent heat of evaporation( J g⁻¹ )	2497
Latent heat of fusion( J g⁻¹ )	59.6
Specific heat( J K⁻¹ kg⁻¹ )	213@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )	66.8@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	23.5@0-100°C

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Tin Sputtering Target

Material Properties for Metals