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Composition: Sn
Form: Foil/Film/Sheet
Material: Tin
CAS Number: 7440-31-5
Commodity: Metals
Tin Foil is a highly malleable, corrosion-resistant material with a low melting point (~232 °C) and excellent barrier performance against gases, moisture, and contaminants. Its smooth surface is chemically inert, non-toxic, and ideal for cleanroom or food-safe environments. Mechanically pliable and thermally stable in ambient conditions, tin foil is commonly used in electromagnetic shielding, food and pharmaceutical packaging, precision gaskets, and vacuum sealing. In electronics, it functions as an electrostatic discharge barrier or EMI shield for circuit components. In packaging, multi-layer laminates incorporate tin foil for antimicrobial, anti-aging, and oxygen barrier functions. Tin foil also supports high-vacuum enclosures in analytical instrumentation, where permeability control and cleanliness are critical. In both industrial and research contexts, tin foil is valued for its mechanical workability, chemical inertness, and compatibility with high-purity sealing, wrapping, or surface protection processes.
Tolerances
Foil
| Thickness | <0.01mm | ±25% |
|---|---|---|
| Thickness | 0.01mm - 0.05mm | ±15% |
| Thickness | >0.05mm | ±10% |
Material Properties for Metals
Atomic Properties
| Element | Value |
|---|---|
| Atomic number | 50 |
| Crystal structure | Tetragonal |
| Electronic structure | Kr 4d¹⁰ 5s² 5p² |
| Valences shown | 2,4 |
| Atomic weight( amu ) | 118.69 |
| Thermal neutron absorption cross-section( Barns ) | 0.63 |
| Photo-electric work function( eV ) | 4.3 |
| Natural isotope distribution( Mass No./% ) | 122/ 4.6 |
| Natural isotope distribution( Mass No./% ) | 124/ 5.6 |
| Natural isotope distribution( Mass No./% ) | 114/ 0.7 |
| Natural isotope distribution( Mass No./% ) | 120/ 32.4 |
| Natural isotope distribution( Mass No./% ) | 118/ 24.3 |
| Natural isotope distribution( Mass No./% ) | 112/ 1.0 |
| Natural isotope distribution( Mass No./% ) | 116/ 14.7 |
| Natural isotope distribution( Mass No./% ) | 115/ 0.4 |
| Natural isotope distribution( Mass No./% ) | 117/ 7.7 |
| Natural isotope distribution( Mass No./% ) | 119/ 8.6 |
| Atomic radius - Goldschmidt( nm ) | 0.158 |
| Ionisation potential( No./eV ) | 2/ 14.63 |
| Ionisation potential( No./eV ) | 5/ 72.3 |
| Ionisation potential( No./eV ) | 3/ 30.5 |
| Ionisation potential( No./eV ) | 4/ 40.7 |
| Ionisation potential( No./eV ) | 1/ 7.34 |
Mechanical Properties
| Element | Value |
|---|---|
| Hardness - Mohs | 1.5-1.8 |
| Material condition | Polycrystalline |
| Poisson's ratio | 0.357 |
| Bulk modulus( GPa ) | 58.2 |
| Tensile modulus( GPa ) | 49.9 |
Electrical Properties
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 12.6@20@20°C |
| Superconductivity critical temperature( K ) | 3.722 |
| Temperature coefficient( K⁻¹ ) | 0.0046@0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C)( mV ) | 0.42 |
Physical Properties
| Element | Value |
|---|---|
| Boiling point( C ) | 2270 |
| Density( gcm⁻³ ) | 7.28@20°C |
Thermal Properties
| Element | Value |
|---|---|
| Melting point( C ) | 231.9 |
| Latent heat of evaporation( J g⁻¹ ) | 2497 |
| Latent heat of fusion( J g⁻¹ ) | 59.6 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 213@25°C |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 66.8@0-100°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 23.5@0-100°C |
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