Indium Spooled Rod

Indium Spooled Rod offers the same ductility, corrosion resistance, and excellent bonding properties of indium in a continuous form wound onto spools for convenient handling and precise dispensing. This geometry ensures flexibility in processing while maintaining structural integrity for forming, sealing, and joining operations. Industries such as microelectronics, optics, and vacuum engineering use indium spooled rods for soldering fine components, sealing cryogenic systems, and producing custom-shaped gaskets. Specific technologies include wire bonding in semiconductors, infrared optical device mounting, and controlled deposition in research-scale alloy fabrication. Research applications examine the controlled flow and formability of indium for advanced joining techniques, high-precision soldering, and adaptable cryogenic sealing. The spooled format supports continuous supply for automated manufacturing and experimental trials. Its combination of functional versatility and convenient geometry makes indium spooled rods highly valuable in both industrial production and advanced research contexts.

Quick Links:

Tolerance

Properties

Reference & Citations

each

Tolerances

Rod

Diameter	=<10mm	±10%
Diameter	>10mm	±5%

Material Properties for Metals

Atomic Properties

Element	Value
Atomic number	49
Crystal structure	Face centred tetragonal
Electronic structure	Kr 4d¹⁰ 5s² 5p¹
Valences shown	1, 2, 3
Atomic weight( amu )	114.82
Thermal neutron absorption cross-section( Barns )	194
Photo-electric work function( eV )	4.12
Natural isotope distribution( Mass No./% )	113/ 4.3
Natural isotope distribution( Mass No./% )	115/ 95.7
Atomic radius - Goldschmidt( nm )	0.157
Ionisation potential( No./eV )	3/ 28.0
Ionisation potential( No./eV )	Apr-54
Ionisation potential( No./eV )	2/ 18.9
Ionisation potential( No./eV )	1/ 5.79

Mechanical Properties

Element	Value
Material condition	Polycrystalline
Material condition	Soft
Poisson's ratio	0.45
Poisson's ratio	0.45
Bulk modulus( GPa )	35.3
Bulk modulus( GPa )	35.3
Tensile modulus( GPa )	10.6
Tensile modulus( GPa )	10.6
Hardness - Vickers( kgf mm⁻² )	10
Tensile strength( MPa )	2.6-4.5

Electrical Properties

Element	Value
Electrical resistivity( µOhmcm )	8.8@20@20°C
Superconductivity critical temperature( K )	3.41
Temperature coefficient( K⁻¹ )	0.0052@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV )	0.69

Physical Properties

Element	Value
Boiling point( C )	2080
Density( gcm⁻³ )	7.3@20°C

Thermal Properties

Element	Value
Melting point( C )	156.6
Latent heat of evaporation( J g⁻¹ )	2024
Latent heat of fusion( J g⁻¹ )	28.5
Specific heat( J K⁻¹ kg⁻¹ )	234@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )	81.8@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	24.8@0-100°C