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Formula: In
Form: Wire
Material: Indium
CAS Number: 7440-74-6
Commodity: Metals
Purity: 99.999%
Temper: As Drawn
Indium spooled wire is widely used in various research and industrial applications due to its unique properties such as low melting point, excellent thermal and electrical conductivity, and malleability. In microelectronics, it enhances flip-chip bonding by improving contact resistance for high-frequency applications. It is also employed in superconducting wire development for low-loss current maintenance. In thermal management, indium's thermal conductivity aids in cooling electronics. Additionally, its ductility and low melting point make it ideal for soldering in aerospace. The latest research has demonstrate its usefulness in energy storage for improved battery efficiency and in additive manufacturing for precision printing in electronics and sensors.
Technical Data Sheet Safety Data Sheet Tolerance Properties
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Tolerances

Wire
Diameter ±10%
Length +5% / -1%

Material Properties for Metals

Atomic Properties
Element Value
Atomic number 49
Crystal structure Face centred tetragonal
Electronic structure Kr 4d¹⁰ 5s² 5p¹
Valences shown 1, 2, 3
Atomic weight( amu ) 114.82
Thermal neutron absorption cross-section( Barns ) 194
Photo-electric work function( eV ) 4.12
Natural isotope distribution( Mass No./% ) 113/ 4.3
Natural isotope distribution( Mass No./% ) 115/ 95.7
Atomic radius - Goldschmidt( nm ) 0.157
Ionisation potential( No./eV ) 3/ 28.0
Ionisation potential( No./eV ) Apr-54
Ionisation potential( No./eV ) 2/ 18.9
Ionisation potential( No./eV ) 1/ 5.79
Mechanical Properties
Element Value
Material condition Polycrystalline
Material condition Soft
Poisson's ratio 0.45
Poisson's ratio 0.45
Bulk modulus( GPa ) 35.3
Bulk modulus( GPa ) 35.3
Tensile modulus( GPa ) 10.6
Tensile modulus( GPa ) 10.6
Hardness - Vickers( kgf mm⁻² ) 10
Tensile strength( MPa ) 2.6-4.5
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 8.8@20@20°C
Superconductivity critical temperature( K ) 3.41
Temperature coefficient( K⁻¹ ) 0.0052@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) 0.69
Physical Properties
Element Value
Boiling point( C ) 2080
Density( gcm⁻³ ) 7.3@20°C
Thermal Properties
Element Value
Melting point( C ) 156.6
Latent heat of evaporation( J g⁻¹ ) 2024
Latent heat of fusion( J g⁻¹ ) 28.5
Specific heat( J K⁻¹ kg⁻¹ ) 234@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 81.8@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 24.8@0-100°C

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