Indium Disk

Indium Disk provides excellent ductility, low melting point, and outstanding ability to wet and bond to a wide range of materials in a compact circular form. These properties make it indispensable for sealing, bonding, and heat transfer applications. Industries such as electronics, aerospace, and cryogenics employ indium disks in vacuum sealing gaskets, thermal interface layers, and hermetic seals for optical and electronic devices. Specific technologies include cryogenic sealing of superconducting systems, bonding in infrared optics, and pressure-sealing in high-vacuum chambers. Research applications explore its wetting behavior in microelectronics, development of low-temperature solders, and optimization of thin-film adhesion. The disk form ensures consistent geometry for reliable performance in precision assemblies. Its unique combination of softness, chemical stability, and conductivity makes indium disks critical for advancing scientific instrumentation and high-reliability industrial systems.

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Tolerance

Properties

Reference & Citations

each

Tolerances

Disc

Thickness	>0.05mm	±10%
Thickness	<0.01mm	±25%
Thickness	0.01mm - 0.05mm	±15%

Material Properties for Metals

Atomic Properties

Element	Value
Atomic number	49
Crystal structure	Face centred tetragonal
Electronic structure	Kr 4d¹⁰ 5s² 5p¹
Valences shown	1, 2, 3
Atomic weight( amu )	114.82
Thermal neutron absorption cross-section( Barns )	194
Photo-electric work function( eV )	4.12
Natural isotope distribution( Mass No./% )	113/ 4.3
Natural isotope distribution( Mass No./% )	115/ 95.7
Atomic radius - Goldschmidt( nm )	0.157
Ionisation potential( No./eV )	3/ 28.0
Ionisation potential( No./eV )	Apr-54
Ionisation potential( No./eV )	2/ 18.9
Ionisation potential( No./eV )	1/ 5.79

Mechanical Properties

Element	Value
Material condition	Polycrystalline
Material condition	Soft
Poisson's ratio	0.45
Poisson's ratio	0.45
Bulk modulus( GPa )	35.3
Bulk modulus( GPa )	35.3
Tensile modulus( GPa )	10.6
Tensile modulus( GPa )	10.6
Hardness - Vickers( kgf mm⁻² )	10
Tensile strength( MPa )	2.6-4.5

Electrical Properties

Element	Value
Electrical resistivity( µOhmcm )	8.8@20@20°C
Superconductivity critical temperature( K )	3.41
Temperature coefficient( K⁻¹ )	0.0052@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV )	0.69

Physical Properties

Element	Value
Boiling point( C )	2080
Density( gcm⁻³ )	7.3@20°C

Thermal Properties

Element	Value
Melting point( C )	156.6
Latent heat of evaporation( J g⁻¹ )	2024
Latent heat of fusion( J g⁻¹ )	28.5
Specific heat( J K⁻¹ kg⁻¹ )	234@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )	81.8@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	24.8@0-100°C