Indium Foil

Designed for demanding environments, Goodfellow's Indium Foil offers exceptional ductility and thermal interface performance - making it ideal for electronics, cryogenics, vacuum systems, and precision bonding. Manufactured from 99.8% to 99.999% pure indium with tight thickness ranges (0.002 mm to 3 mm), it conforms effortlessly to surface irregularities, ensuring minimal thermal resistance and reliable contact under pressure. Available in widths from 10 mm to 305 mm and lengths up to 1000 mm, it integrates seamlessly into assemblies where heat transfer, seal durability, and material purity are critical. Indium’s low melting point supports low-temperature soldering and bonding, while its cryogenic flexibility enables leak-tight seals down to at least -150 °C. Its self-passivating oxide layer ensures long-term stability without compromising conductivity or thermal performance. Indium’s compatibility with a wide range of metals makes it a preferred material for hybrid bonding, optoelectronics, and micro-joining. Whether used as a thermal interface, sealing gasket, or thin-film deposition source, our indium foil delivers precision, purity, and performance across the most advanced scientific and industrial environments.