Hot-pressed Silicon Nitride Sputtering Target

Formula: Si₃N₄

Form: Sputtering Target

Material: Hot-pressed Silicon Nitride

Commodity: Ceramics

Production Method: Hot Pressed

Hot-pressed Silicon Nitride Sputtering Targets are a high-purity, high-density ceramic material offered within our extensive range of sputtering targets. With 6 size variations available, they can be customized for use as sputtering targets in thin film deposition systems. Their silicon nitride composition provides properties like high hardness, wear resistance and chemical inertness, making them useful for thin films applications such as protective coatings, semiconductor devices and optical coatings.

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Technical Data Sheet Safety Data Sheet Tolerance Properties

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Material Properties for Ceramics

Chemical Resistance

Element	Value
Acids - concentrated	Fair
Acids - dilute	Good
Alkalis	Good-Poor
Halogens	Good
Metals	Fair

Electrical Properties

Element	Value
Dielectric constant	10
Volume resistivity( Ohmcm )	10¹²-10¹⁵@25

Physical Properties

Element	Value
Apparent porosity( % )	0
Density( gcm⁻³ )	3.11

Thermal Properties

Element	Value
Sublimation point( C )	1900
Upper continuous use temperature( C )	1100-1650
Specific heat( J K⁻¹ kg⁻¹ )	680-800@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )	15-43@20°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	3.3@20-1000°C