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Hot-pressed Silicon Nitride Sputtering Target

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Properties common to all products in this list

Grade: Hot-Pressed Composition: Si₃N₄ Form: Sputtering Target Material: Silicon Nitride Commodity: Ceramics Production Method: Hot Pressed
Hot-pressed Silicon Nitride Sputtering Target is a high-density ceramic engineered for thin-film deposition, known for its superior mechanical strength, thermal stability, and chemical resistance. Its ability to withstand high-power plasma environments without decomposition makes it essential for semiconductor, solar energy, and optical industries. Specific applications include the deposition of anti-reflective coatings for solar cells, gate dielectrics and etch masks in semiconductor fabrication, and optical waveguides in biosensing devices. Research shows that sputtered Si₃N₄ films exhibit high optical transparency (≈92% in the visible range), tunable refractive indices, and strong chemical stability, making them ideal for optoelectronic and protective applications. Processing advances, including optimized sputtering pressures and hot-pressing techniques, enhance film uniformity, reduce surface roughness, and improve mechanical reliability. In both research and industrial contexts, Hot-pressed Silicon Nitride Sputtering Target is a cornerstone material, enabling next-generation electronics, energy devices, and advanced optical systems.
Starting at $660.00 each
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Material Properties

Chemical Resistance
Element Value
Acids - concentrated Fair
Acids - dilute Good
Alkalis Good-Poor
Halogens Good
Metals Fair
Electrical Properties
Element Value
Dielectric constant 10
Volume resistivity( Ohmcm ) 10¹²-10¹⁵@25
Physical Properties
Element Value
Apparent porosity( % ) 0
Density( gcm⁻³ ) 3.11
Thermal Properties
Element Value
Sublimation point( C ) 1900
Upper continuous use temperature( C ) 1100-1650
Specific heat( J K⁻¹ kg⁻¹ ) 680-800@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 15-43@20°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 3.3@20-1000°C
Mechanical Properties
Element Value
Tensile modulus( GPa ) 280-310
Hardness - Vickers( kgf mm⁻² ) 1700-2200
Shear strength( MPa ) 480-960
Tensile strength( MPa ) 400-580
Pultrusions
Element Value
Compressive strength( MPa ) 2000-3500
each

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Available Configurations

Properties common to all products in this list

Grade: Hot-Pressed Composition: Si₃N₄ Form: Sputtering Target Material: Silicon Nitride Commodity: Ceramics Production Method: Hot Pressed

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Tolerances

Disk
Thickness ±20%
Diameter ±0.5mm