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Formula: Al
Form: Sputtering Target
Material: Aluminum
CAS Number: 7429-90-5
Commodity: Metals
Purity: 99.999%
Aluminum Sputtering Targets are round, flat piece of high purity aluminum available in 21 diameter variations. They exhibit properties like high thermal and electrical conductivity, low density and resistance to corrosion. These disks can be used as sputtering targets in semiconductor device fabrication to deposit uniform aluminum films using magnetron sputtering. They can also be used as x-ray targets for analytical techniques like x-ray fluorescence spectroscopy. Thanks to the wide range of size options we offer, Aluminum Sputtering Targets provide flexibility in sputtering system design and testing.
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Material Properties for Metals

Atomic Properties
Element Value
Atomic number 13
Crystal structure Face centred cubic
Electronic structure Ne 3s² 3p¹
Valences shown 3
Atomic weight( amu ) 26.98154
Thermal neutron absorption cross-section( Barns ) 0.232
Photo-electric work function( eV ) 4.2
Atomic radius - Goldschmidt( nm ) 0.143
Ionisation potential( No./eV ) 4/ 120
Ionisation potential( No./eV ) 5/ 154
Ionisation potential( No./eV ) 6/ 190
Ionisation potential( No./eV ) 1/ 5.99
Ionisation potential( No./eV ) 3/ 28.4
Ionisation potential( No./eV ) 2/ 18.8
Mechanical Properties
Element Value
Material condition Soft
Material condition Hard
Poisson's ratio 0.345
Poisson's ratio 0.345
Bulk modulus( GPa ) 75.2
Bulk modulus( GPa ) 75.2
Tensile modulus( GPa ) 70.6
Tensile modulus( GPa ) 70.6
Hardness - Vickers( kgf mm⁻² ) 21
Hardness - Vickers( kgf mm⁻² ) 35-48
Tensile strength( MPa ) 130-195
Tensile strength( MPa ) 50-90
Yield strength( MPa ) 110-170
Yield strength( MPa ) Oct-35
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 2.67@20@20°C
Superconductivity critical temperature( K ) 1.175
Temperature coefficient( K⁻¹ ) 0.0045@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) 0.42
Physical Properties
Element Value
Boiling point( C ) 2467
Density( gcm⁻³ ) 2.7@20°C
Thermal Properties
Element Value
Melting point( C ) 660.4
Latent heat of evaporation( J g⁻¹ ) 10800
Latent heat of fusion( J g⁻¹ ) 388
Specific heat( J K⁻¹ kg⁻¹ ) 900@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 237@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 23.5@0-100°C

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