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Grade: Heat Sealable - Minimum 130°C
Formula: PP
Form: Disk
Material: PP
CAS Number: 9003-07-0
Commodity: Polymers
Structure:
Biaxially Oriented
Transparency:
Clear/Transparent
The Heat Sealable - Minimum 130°C PP disks are available as a range of polypropylene disks. With a minimum heat seal initiation temperature of 130°C, they’re ideal for applications requiring heat sealing such as packaging. The heat sealable polypropylene material allows these disks to be used as closure seals in food, medical and consumer product packaging that requires secure and tamper-evident closure. Goodfellow offers 4 variations of this useful disk with diameters ranging from 15mm to 50mm.
Tolerances
Disk
| Thickness | ±20% |
|---|
Material Properties for Polymers
Chemical Resistance
| Element | Value |
|---|---|
| Acids - concentrated | Good-Fair |
| Acids - dilute | Good-Fair |
| Alcohols | Good |
| Alkalis | Good |
| Aromatic hydrocarbons | Fair |
| Greases and Oils | Good-Fair |
| Halogenated Hydrocarbons | Good-Poor |
| Halogens | Poor |
| Ketones | Good |
Mechanical Properties
| Element | Value |
|---|---|
| Coefficient of friction | 0.1-0.3 |
| Hardness - Rockwell | R80-100 |
| Elongation at break( % ) | 150-300, for biax film >50 |
| Tensile modulus( GPa ) | 0.9-1.5, for biax film 2.2-4.2 |
| Izod impact strength( J m⁻¹ ) | 20-100 |
| Abrasive resistance - ASTM D1044( mg/1000 cycles ) | 13-16 |
| Tensile strength( MPa ) | 25-40, for biax film 130-300, |
Electrical Properties
| Element | Value |
|---|---|
| Dielectric constant @1MHz | 2.2-2.6 |
| Dissipation factor @ 1MHz | 0.0003-0.0005 |
| Dielectric strength( kV mm⁻¹ ) | 30-40 |
| Surface resistivity( Ohm/sq ) | 10¹³ |
| Volume resistivity( Ohmcm ) | 10¹⁶-10¹⁸ |
Physical Properties
| Element | Value |
|---|---|
| Flammability | HB |
| Radiation resistance | Fair |
| Refractive index | 1.49 |
| Resistance to Ultra-violet | Poor |
| Limiting oxygen index( % ) | 18 |
| Water absorption - equilibrium( % ) | 0.03 |
| Density( gcm⁻³ ) | 0.9 |
Thermal Properties
| Element | Value |
|---|---|
| Heat-deflection temperature - 0.45MPa( C ) | 100-105 |
| Heat-deflection temperature - 1.8MPa( C ) | 60-65 |
| Lower working temperature( C ) | 50 |
| Upper working temperature( C ) | 90-120 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 1700-1900 |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 0.1-0.22@23°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 100-180 |