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Grade: Heat Sealable - Minimum 130°C
Formula: PP
Form: Foil
Material: PP
CAS Number: 9003-07-0
Commodity: Polymers
Thickness:
0.03mm
Structure:
Biaxially Oriented
Transparency:
Clear/Transparent
Heat Sealable - Minimum 130°C PP film is part of Goodfellow's range of polypropylene films that can be heat sealed at relatively low temperatures. With 2 variations, this film provides options for different temperature requirements, thicknesses and surface finishes. The film's heat sealability makes it useful for packaging applications where contents need to be professionally sealed. It can also be used as a label material due to its printability and ability to adhere to substrates when heat is applied. With its versatile properties, Heat Sealable - Minimum 130°C PP films enables efficient packaging and labeling across many industries.
Tolerances
Foil
| Thickness | ±20% |
|---|
Material Properties for Polymers
Chemical Resistance
| Element | Value |
|---|---|
| Acids - concentrated | Good-Fair |
| Acids - dilute | Good-Fair |
| Alcohols | Good |
| Alkalis | Good |
| Aromatic hydrocarbons | Fair |
| Greases and Oils | Good-Fair |
| Halogenated Hydrocarbons | Good-Poor |
| Halogens | Poor |
| Ketones | Good |
Mechanical Properties
| Element | Value |
|---|---|
| Coefficient of friction | 0.1-0.3 |
| Hardness - Rockwell | R80-100 |
| Elongation at break( % ) | 150-300, for biax film >50 |
| Tensile modulus( GPa ) | 0.9-1.5, for biax film 2.2-4.2 |
| Izod impact strength( J m⁻¹ ) | 20-100 |
| Abrasive resistance - ASTM D1044( mg/1000 cycles ) | 13-16 |
| Tensile strength( MPa ) | 25-40, for biax film 130-300, |
Electrical Properties
| Element | Value |
|---|---|
| Dielectric constant @1MHz | 2.2-2.6 |
| Dissipation factor @ 1MHz | 0.0003-0.0005 |
| Dielectric strength( kV mm⁻¹ ) | 30-40 |
| Surface resistivity( Ohm/sq ) | 10¹³ |
| Volume resistivity( Ohmcm ) | 10¹⁶-10¹⁸ |
Physical Properties
| Element | Value |
|---|---|
| Flammability | HB |
| Radiation resistance | Fair |
| Refractive index | 1.49 |
| Resistance to Ultra-violet | Poor |
| Limiting oxygen index( % ) | 18 |
| Water absorption - equilibrium( % ) | 0.03 |
| Density( gcm⁻³ ) | 0.9 |
Thermal Properties
| Element | Value |
|---|---|
| Heat-deflection temperature - 0.45MPa( C ) | 100-105 |
| Heat-deflection temperature - 1.8MPa( C ) | 60-65 |
| Lower working temperature( C ) | 50 |
| Upper working temperature( C ) | 90-120 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 1700-1900 |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 0.1-0.22@23°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 100-180 |
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