Rhenium Sputtering Target

Rhenium Sputtering Target combines extreme melting point, excellent electrical conductivity, and resistance to chemical attack in a dense, uniform format designed for high-purity thin-film deposition. This form ensures consistent erosion patterns during sputtering, allowing precise control of film thickness and composition. Industries use rhenium targets in microelectronics for contact metallization, in aerospace coatings for oxidation resistance, and in optical systems requiring high-reflectivity, durable films. Research applications include deposition of rhenium-based superconducting layers, high-temperature barrier coatings, and catalytic surfaces for hydrogen production. The sputtering target’s combination of material purity, form stability, and deposition efficiency makes it a critical enabler in both advanced manufacturing and experimental materials development.

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Properties

Reference & Citations

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Material Properties for Metals

Atomic Properties

Element	Value
Atomic number	75
Crystal structure	Hexagonal close packed
Electronic structure	Xe 4f¹⁴ 5d⁵ 6s²
Valences shown	-1,1,2,3,4,5,6,7
Atomic weight( amu )	186.207
Thermal neutron absorption cross-section( Barns )	85
Photo-electric work function( eV )	5
Natural isotope distribution( Mass No./% )	187/ 62.6
Natural isotope distribution( Mass No./% )	185/ 37.4
Atomic radius - Goldschmidt( nm )	0.138
Ionisation potential( No./eV )	1/ 7.87
Ionisation potential( No./eV )	2/ 16.6

Mechanical Properties

Element	Value
Material condition	Soft
Material condition	Hard
Poisson's ratio	0.26
Poisson's ratio	0.26
Bulk modulus( GPa )	334
Bulk modulus( GPa )	334
Tensile modulus( GPa )	466
Tensile modulus( GPa )	466
Hardness - Vickers( kgf mm⁻² )	280
Hardness - Vickers( kgf mm⁻² )	700
Tensile strength( MPa )	2225
Tensile strength( MPa )	1125
Yield strength( MPa )	315
Yield strength( MPa )	2150

Electrical Properties

Element	Value
Electrical resistivity( µOhmcm )	18.7@20@20°C
Superconductivity critical temperature( K )	1.7
Temperature coefficient( K⁻¹ )	0.0045@0-100°C

Physical Properties

Element	Value
Boiling point( C )	5627
Density( gcm⁻³ )	21@20

Thermal Properties

Element	Value
Melting point( C )	3180
Latent heat of evaporation( J g⁻¹ )	3824
Latent heat of fusion( J g⁻¹ )	179.9
Specific heat( J K⁻¹ kg⁻¹ )	138@25
Thermal conductivity( W m⁻¹ K⁻¹ )	48@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	6.6@0-100°C