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Grade: Lexan® 8B35
Formula: PC
Form: Disk
Material: Polycarbonate (PC)
CAS Number: 25766-59-0
Commodity: Polymers
Thickness: 0.125mm
Surface Finish: Velvet / Matte
Transparency: Transparent

Lexan® 8B35 Polycarbonate Disk

Lexan® 8B35 Polycarbonate Disk is engineered for high impact resistance, optical clarity, and excellent dimensional stability, making it suitable for precision components in advanced industries. In disk form, it provides uniformity and structural consistency, essential for use in data storage, optics, and electronic systems. Industries such as automotive, aerospace, and electronics frequently employ this material due to its balance of toughness and transparency. Specific applications include optical storage substrates, protective covers in sensor systems, and display technologies requiring both clarity and durability. Research demonstrates that Lexan® polycarbonate disks undergo significant structural and optical modifications under irradiation and ion implantation, enabling advancements in hardness, wear resistance, and optical behavior. These findings highlight their dual role as both functional industrial materials and experimental research platforms. By merging adaptability with high-performance properties, Lexan® 8B35 Polycarbonate Disk holds a critical place in scientific innovation and industrial technology.
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Tolerances

Disc
Thickness ±20%

Material Properties for Polymers

Physical Properties
Element Value
Abbe number 34
Flammability V0-V2
Radiation resistance Fair
Refractive index 1.584-6
Resistance to Ultra-violet Fair
Limiting oxygen index( % ) 25-27
Water absorption - equilibrium( % ) 0.35
Water absorption - over 24 hours( % ) 0.1
Density( gcm⁻³ ) 1.2
Chemical Resistance
Element Value
Acids - concentrated Good
Acids - dilute Good
Alcohols Good
Alkalis Good-Poor
Aromatic hydrocarbons Poor
Greases and Oils Good-Fair
Halogenated Hydrocarbons Good-Poor
Halogens Poor
Ketones Poor
Mechanical Properties
Element Value
Coefficient of friction 0.31
Hardness - Rockwell M70
Poisson's ratio 0.37
Elongation at break( % ) 100-150
Tensile modulus( GPa ) 2.3-2.4
Izod impact strength( J m⁻¹ ) 600-850
Abrasive resistance - ASTM D1044( mg/1000 cycles ) Oct-15
Tensile strength( MPa ) 55-75
Electrical Properties
Element Value
Dielectric constant @1MHz 2.9
Dissipation factor @ 1MHz 0.01
Dielectric strength( kV mm⁻¹ ) 15-67
Surface resistivity( Ohm/sq ) 10¹⁵
Volume resistivity( Ohmcm ) 10¹⁴-10¹⁶
Thermal Properties
Element Value
Heat-deflection temperature - 0.45MPa( C ) 140
Heat-deflection temperature - 1.8MPa( C ) 128-138
Lower working temperature( C ) -135
Upper working temperature( C ) 115-130
Specific heat( J K⁻¹ kg⁻¹ ) 1200
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.19-0.22@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 66-70
Pultrusions
Element Value
Compressive strength( MPa ) >80

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