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Formula: PC
Form: Foil
Material: Polycarbonate (PC)
CAS Number: 25766-59-0
Commodity: Polymers
Studies on polycarbonate (PC) films highlight its versatility in cutting-edge applications based on optical clarity, high impact resistance, and excellent thermal stability. In photovoltaic systems, polycarbonate films are used as protective layers, safeguarding solar cells from mechanical and environmental damage. Their dielectric properties make them critical in flexible electronics and capacitors, offering reliability in compact and lightweight designs. Researchers have explored their application in automotive head-up displays for enhanced optical precision and reduced weight. Additionally, the films' resistance to UV degradation and chemicals makes them suitable for aerospace and biomedical uses, ensuring durability in extreme environments. These findings underscore their growing importance in advanced technology sectors.
Tolerances
Foil
| Thickness | ±20% |
|---|
Material Properties for Polymers
Physical Properties
| Element | Value |
|---|---|
| Abbe number | 34 |
| Flammability | V0-V2 |
| Radiation resistance | Fair |
| Refractive index | 1.584-6 |
| Resistance to Ultra-violet | Fair |
| Limiting oxygen index( % ) | 25-27 |
| Water absorption - equilibrium( % ) | 0.35 |
| Water absorption - over 24 hours( % ) | 0.1 |
| Density( gcm⁻³ ) | 1.2 |
Chemical Resistance
| Element | Value |
|---|---|
| Acids - concentrated | Good |
| Acids - dilute | Good |
| Alcohols | Good |
| Alkalis | Good-Poor |
| Aromatic hydrocarbons | Poor |
| Greases and Oils | Good-Fair |
| Halogenated Hydrocarbons | Good-Poor |
| Halogens | Poor |
| Ketones | Poor |
Mechanical Properties
| Element | Value |
|---|---|
| Coefficient of friction | 0.31 |
| Hardness - Rockwell | M70 |
| Poisson's ratio | 0.37 |
| Elongation at break( % ) | 100-150 |
| Tensile modulus( GPa ) | 2.3-2.4 |
| Izod impact strength( J m⁻¹ ) | 600-850 |
| Abrasive resistance - ASTM D1044( mg/1000 cycles ) | Oct-15 |
| Tensile strength( MPa ) | 55-75 |
Electrical Properties
| Element | Value |
|---|---|
| Dielectric constant @1MHz | 2.9 |
| Dissipation factor @ 1MHz | 0.01 |
| Dielectric strength( kV mm⁻¹ ) | 15-67 |
| Surface resistivity( Ohm/sq ) | 10¹⁵ |
| Volume resistivity( Ohmcm ) | 10¹⁴-10¹⁶ |
Thermal Properties
| Element | Value |
|---|---|
| Heat-deflection temperature - 0.45MPa( C ) | 140 |
| Heat-deflection temperature - 1.8MPa( C ) | 128-138 |
| Lower working temperature( C ) | -135 |
| Upper working temperature( C ) | 115-130 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 1200 |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 0.19-0.22@23°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 66-70 |
Pultrusions
| Element | Value |
|---|---|
| Compressive strength( MPa ) | >80 |
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