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Formula: Pb
Form: Sputtering Target
Material: Lead
CAS Number: 7439-92-1
Commodity: Metals
Purity: 99.99%
Hazard Pictogram: GHS08
Our Lead Sputtering Targets are available in 5 variations. These high-purity disks have uniform composition and density that makes them ideal for depositing uniform lead coatings onto substrates. Lead coatings are used in semiconductor devices, optical coatings and as a corrosion barrier. Our selection of lead sputtering target disks in different sizes provides flexibility for various sputtering systems and applications.
Technical Data Sheet Safety Data Sheet Tolerance Properties

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Material Properties for Metals

Atomic Properties
Element Value
Atomic number 82
Crystal structure Face centred cubic
Electronic structure Xe 4f¹⁴ 5d¹⁰ 6s² 6p²
Valences shown 2, 4
Atomic weight( amu ) 207.2
Thermal neutron absorption cross-section( Barns ) 0.18
Photo-electric work function( eV ) 4
Natural isotope distribution( Mass No./% ) 207/ 22.1
Natural isotope distribution( Mass No./% ) 208/ 52.4
Natural isotope distribution( Mass No./% ) 206/ 24.1
Natural isotope distribution( Mass No./% ) 204/ 1.4
Atomic radius - Goldschmidt( nm ) 0.175
Ionisation potential( No./eV ) 5/ 68.8
Ionisation potential( No./eV ) 3/ 31.9
Ionisation potential( No./eV ) 4/ 42.3
Ionisation potential( No./eV ) 2/ 15.03
Ionisation potential( No./eV ) 1/ 7.42
Mechanical Properties
Element Value
Hardness - Mohs 1.5
Material condition Polycrystalline
Material condition Sand cast
Poisson's ratio 0.44
Poisson's ratio 0.44
Bulk modulus( GPa ) 45.8
Bulk modulus( GPa ) 45.8
Tensile modulus( GPa ) 16.1
Tensile modulus( GPa ) 16.1
Tensile strength( MPa ) 12
Yield strength( MPa ) 5.5
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 20.6@20@20°C
Superconductivity critical temperature( K ) 7.196
Temperature coefficient( K⁻¹ ) 0.0042@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) 0.44
Physical Properties
Element Value
Boiling point( C ) 1740
Density( gcm⁻³ ) 11.35@20
Thermal Properties
Element Value
Melting point( C ) 327.5
Latent heat of evaporation( J g⁻¹ ) 862
Latent heat of fusion( J g⁻¹ ) 23.2
Specific heat( J K⁻¹ kg⁻¹ ) 159@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 35.3@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 29@0-100°C

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