Kapton® HPP-ST Polyimide Disk

Kapton® HPP-ST is DuPont's dual-surface-treated, high-performance polyimide film — the grade of choice when low residual shrinkage and superior adhesion to copper and bonding systems are the primary substrate selection criteria. It shares the full property profile of general-purpose Kapton® HN across the −269 °C to +400 °C thermal range, but its modified surface treatment delivers consistent adhesion of 10 pli (1.8 N/mm) to acrylic adhesive and copper foil across all four gauges, and its residual shrinkage of just 0.03 % after 30 minutes at 150 °C is significantly lower than standard HN — making it the preferred dielectric for multilayer flex circuits, rigid-flex PCB cores, and precision patterned substrates where dimensional shift during thermal processing causes registration error or yield loss. Available as 0.125 mm and certified to ASTM D-5213, Kapton® HPP-ST delivers a dielectric strength of up to 303 kV/mm at 25 µm, a volume resistivity of 1.5 × 10¹⁷ Ω·cm, a dielectric constant of 3.4 at 1 kHz, and a UL 94 V-0 flame rating. Its applications span electronic parts, PCB stencils, screen printing substrates, and insulation tubing — and wherever the dimensional precision of HN is insufficient for the tolerance requirements of the process.