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Kapton® HPP-ST Polyimide Film
Available Configurations
Properties common to all products in this list
| Thickness | Sides | Other Grades |
|---|---|---|
| 0.125 mm | 10 mm × 10 mm to 300 mm × 300 mm | HN, FPC, MT, B, CRC, 200RS100 |
Need custom configurations? Please contact our Technical Solutions team.
Key Features
Kapton® HPP-ST is DuPont's precision-stability polyimide film, formulated for demanding optical, lithographic, and high-accuracy electronic applications where dimensional repeatability is the overriding performance criterion:
Superior Dimensional Stability Under Thermal Cycling
Kapton® HPP-ST exhibits a lower residual shrinkage than standard Kapton® HN — just 0.03 % after 30 minutes at 150 °C across all gauges — minimising the pattern distortion and registration error that arise when films expand or contract during lamination, photolithography, or operational temperature swings. This characteristic makes it the preferred substrate for precision photomasks, rigid-flex PCB core layers, and any application where micron-level dimensional repeatability is non-negotiable.
Modified Surface for Superior Adhesion
The dual-surface treatment of HPP-ST promotes stronger, more consistent adhesion to copper foils, adhesive systems, and laminate materials compared with standard Kapton® HN. This translates to higher peel strengths, lower delamination risk during thermal excursions and chemical processing, and improved manufacturing yield in demanding multilayer flex circuit and substrate fabrication processes.
Exceptional Thermal Range (−269 °C to +400 °C)
HPP-ST retains the full thermal performance of the Kapton® family, maintaining dielectric strength, mechanical integrity, and dimensional stability from deep cryogenic environments to prolonged high-temperature service. This range covers the complete manufacturing process chain — from cryogenic testing of satellite sensor arrays to the high-temperature cure cycles of aerospace composite laminates.
High Dielectric Integrity (up to 303 kV/mm)
With a dielectric strength of up to 303 kV/mm at 25 µm, a volume resistivity of 1.5 × 10¹⁷ Ω·cm, and a stable dielectric constant of 3.4 at 1 kHz, Kapton® HPP-ST provides reliable high-voltage insulation in precision instrumentation, satellite electronics, and cryo-vacuum wiring systems. Its uniform refractive index of 1.70 additionally supports its use as a window or mask material in optical and photolithographic systems.
Radiation and Flame Resistance (UL 94 V-0)
Kapton® HPP-ST carries a UL 94 V-0 flame rating and has demonstrated good radiation resistance, making it suitable for the space and nuclear instrumentation environments where ionising radiation would degrade alternative polymer substrates. Its structural and dielectric integrity is maintained after exposure to the radiation doses encountered in satellite operation, particle physics diagnostics, and high-energy beam instrumentation.
Optical Uniformity for Lithographic & Diagnostic Applications
The high optical uniformity, consistent refractive index of 1.70, and low surface roughness of Kapton® HPP-ST make it suitable as a beam window, photomask substrate, or X-ray transmission window in analytical and diagnostic instruments. Its dimensional stability under repeated thermal and vacuum cycling ensures that optical and geometric calibration is maintained over the service life of the instrument.
Industrial Applications
Kapton® HPP-ST is specified wherever the dimensional precision and processing consistency of the polyimide substrate are as critical as its thermal or electrical performance:
- ✦ Rigid-Flex PCBs & High-Accuracy Multilayer Circuits
- The core dielectric layer in rigid-flex PCBs for satellite electronics, military avionics, and high-reliability computing modules, where the HPP-ST's lower residual shrinkage and superior adhesion enable precise via-to-pad registration across large, thermally stressed multilayer assemblies. Reduces scrap rates and rework in high-value flex circuit fabrication.
- ✦ Space & Satellite Sensor Encapsulation
- Used as a precision encapsulant and structural insulator in satellite attitude sensors, star trackers, and optical bench assemblies, where thermal stability across the full space environment temperature range (−200 °C to +150 °C operational) must be maintained without dimensional shift that would compromise alignment or signal path geometry.
- ✦ Cryogenic Electronics & Superconducting Systems
- Specified as the insulating substrate in cryogenic wiring looms, superconducting magnet interconnects, and dilution refrigerator wiring harnesses, where its lower residual shrinkage reduces the thermomechanical stress generated during cool-down cycles and its stable dielectric performance ensures insulation integrity at liquid helium temperatures.
- ✦ Photolithographic Masking & Precision Patterning
- Applied as a photomask base and precision patterning substrate in semiconductor and MEMS fabrication, where its dimensional stability across humidity and temperature changes allows accurate alignment across multiple lithographic exposures. Its optical uniformity supports both UV and deep-UV mask applications.
- ✦ Particle Physics & Beam Diagnostics
- Used as a window and detector substrate in particle beam diagnostics, scintillator assemblies, and heavy-ion imaging systems at major physics research facilities, where its radiation tolerance, dimensional stability under irradiation, and low atomic number (minimal beam perturbation) make it the material of choice for beam-intercepting instrumentation.
- ✦ Advanced Instrumentation & Metrology
- The dimensional stability and optical uniformity of Kapton® HPP-ST are exploited in precision analytical instruments including X-ray fluorescence windows, infrared transmission cells, laser beam-shaping apertures, and interferometric sensor substrates, where substrate distortion would directly degrade measurement accuracy.
- ✦ Medical Imaging & Diagnostic Device Electronics
- Specified in the flex circuit assemblies of MRI-compatible electronics, diagnostic wearables, and high-density sensor arrays, where the combination of dimensional stability, polyimide chemistry, and sterilisation resistance ensures long-term reliability in body-worn and hospital environments subjected to repeated thermal and chemical cycling.
Material Properties
| Element | Value |
|---|---|
| Acids - concentrated | Poor |
| Acids - dilute | Fair |
| Alcohols | Poor |
| Alkalis | Poor |
| Aromatic hydrocarbons | Good |
| Greases and Oils | Good |
| Halogenated Hydrocarbons | Good |
| Halogens | Fair |
| Ketones | Good |
| Element | Value |
|---|---|
| Coefficient of friction | 0.42 |
| Hardness - Rockwell | E52-99 |
| Elongation at break( % ) | Aug-70 |
| Tensile modulus( GPa ) | 2.0 – 3.0 |
| Izod impact strength( J m⁻¹ ) | 80 |
| Tensile strength( MPa ) | 70-150 |
| Element | Value |
|---|---|
| Dielectric constant @1MHz | 3.4 |
| Dissipation factor @ 1kHz | 0.0018 |
| Dielectric strength( kV mm⁻¹ ) | 154 – 303 |
| Surface resistivity( Ohm/sq ) | 10¹⁶ |
| Volume resistivity( Ohmcm ) | 10¹⁸ |
| Element | Value |
|---|---|
| Flammability | V0 |
| Radiation resistance | Good |
| Refractive index | 1.66 |
| Resistance to Ultra-violet | Poor |
| Limiting oxygen index( % ) | 53 |
| Water absorption - over 24 hours( % ) | 0.2-2.9 |
| Density( gcm⁻³ ) | 1.42 |
| Element | Value |
|---|---|
| Heat-deflection temperature - 1.8MPa( C ) | 360 |
| Lower working temperature( C ) | -270 |
| Upper working temperature( C ) | 250-320 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 1090 |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 0.1-0.35@23°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 30-60 |
Tolerances
| Thickness | ±20% |
|---|