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Composition: PI
Form: Foil/Film/Sheet
Material: Polyimide (PI)
Commodity: Polymers
Engineered for extreme environments, our Polyimide Film offers outstanding thermal stability, electrical insulation, and mechanical flexibility - ideal for aerospace, electronics, medical devices, and clean energy systems. Manufactured in thicknesses from 0.025 mm to 6.35mm and available in lengths and widths up to 500mm, it integrates seamlessly into compact, high-performance assemblies. Polyimide’s ability to withstand high temperatures ensures reliable performance in demanding environments, while its strong insulating capabilities support circuits operating at high voltages and frequencies. Its tensile strength allows it to flex without tearing, making it suitable for dynamic systems and wearable technologies. With resistance to chemicals, radiation, and flame, polyimide performs reliably in harsh industrial and aerospace environments. Low outgassing and dimensional stability make it well-suited for cleanroom and vacuum applications. These properties make our polyimide film an ideal choice for flexible circuits, insulation layers, thermal shielding, and advanced sensor platforms.
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Tolerances

Foil
Thickness ±20%

Material Properties for Polymers

Chemical Resistance
Element Value
Acids - concentrated Poor
Acids - dilute Fair
Alcohols Poor
Alkalis Poor
Aromatic hydrocarbons Good
Greases and Oils Good
Halogenated Hydrocarbons Good
Halogens Fair
Ketones Good
Mechanical Properties
Element Value
Coefficient of friction 0.42
Hardness - Rockwell E52-99
Elongation at break( % ) Aug-70
Tensile modulus( GPa ) 2.0 – 3.0
Izod impact strength( J m⁻¹ ) 80
Tensile strength( MPa ) 70-150
Electrical Properties
Element Value
Dielectric constant @1MHz 3.4
Dissipation factor @ 1kHz 0.0018
Dielectric strength( kV mm⁻¹ ) 22
Surface resistivity( Ohm/sq ) 10¹⁶
Volume resistivity( Ohmcm ) 10¹⁸
Physical Properties
Element Value
Flammability V0
Radiation resistance Good
Refractive index 1.66
Resistance to Ultra-violet Poor
Limiting oxygen index( % ) 53
Water absorption - over 24 hours( % ) 0.2-2.9
Density( gcm⁻³ ) 1.42
Thermal Properties
Element Value
Heat-deflection temperature - 1.8MPa( C ) 360
Lower working temperature( C ) -270
Upper working temperature( C ) 250-320
Specific heat( J K⁻¹ kg⁻¹ ) 1090
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.1-0.35@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 30-60

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