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Grade: DuPont™ Kapton® HPP-ST
Formula: PI
Form: Coil
Material: Polyimide (PI)
CAS Number: 60842-76-4
Commodity: Polymers
Thickness: 0.125mm
Coil Width: 317.6mm

Kapton® HPP-ST Polyimide Coil

Kapton® HPP-ST Polyimide Coil features high thermal stability up to 400°C and excellent electrical insulation, suitable for precise scientific and research applications. Its chemically resistant polyimide film maintains dimensional stability under thermal and mechanical stress, supporting use in flexible electronics, aerospace components, and microelectromechanical systems (MEMS). This coil is well-suited for laboratory environments where reliable performance in sensor fabrication, flexible circuitry, and high-temperature testing is required. Its compatibility with R&D processes enables development of advanced devices demanding consistent material properties and durability.
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Tolerances

Coil
Thickness ±20%

Material Properties for Polymers

Chemical Resistance
Element Value
Acids - concentrated Poor
Acids - dilute Fair
Alcohols Poor
Alkalis Poor
Aromatic hydrocarbons Good
Greases and Oils Good
Halogenated Hydrocarbons Good
Halogens Fair
Ketones Good
Mechanical Properties
Element Value
Coefficient of friction 0.42
Hardness - Rockwell E52-99
Elongation at break( % ) Aug-70
Tensile modulus( GPa ) 2.0 – 3.0
Izod impact strength( J m⁻¹ ) 80
Tensile strength( MPa ) 70-150
Electrical Properties
Element Value
Dielectric constant @1MHz 3.4
Dissipation factor @ 1kHz 0.0018
Dielectric strength( kV mm⁻¹ ) 22
Surface resistivity( Ohm/sq ) 10¹⁶
Volume resistivity( Ohmcm ) 10¹⁸
Physical Properties
Element Value
Flammability V0
Radiation resistance Good
Refractive index 1.66
Resistance to Ultra-violet Poor
Limiting oxygen index( % ) 53
Water absorption - over 24 hours( % ) 0.2-2.9
Density( gcm⁻³ ) 1.42
Thermal Properties
Element Value
Heat-deflection temperature - 1.8MPa( C ) 360
Lower working temperature( C ) -270
Upper working temperature( C ) 250-320
Specific heat( J K⁻¹ kg⁻¹ ) 1090
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.1-0.35@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 30-60

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