Kapton® FPC Polyimide Disk

Kapton® FPC is DuPont's dual-surface-treated polyimide film, engineered specifically for flexible printed circuit manufacturers who require tighter dimensional stability and more consistent adhesion to copper foil than standard Kapton® HN provides. Its surface treatment promotes bonding to both rolled-annealed and electrodeposited copper foils and to the acrylic and epoxy adhesive systems used in flex laminate construction — the property that distinguishes FPC from the general-purpose HN grade and makes it the preferred dielectric substrate for multilayer flex and rigid-flex PCB fabrication. Available from 0.025 mm to 0.125 mm, Kapton® FPC combines MIT folding endurance of up to 285,000 cycles at 25 µm with a dimensional stability of 0.03 % after thermal exposure, a dielectric strength of up to 303 kV/mm, and a dissipation factor of 0.0018 at 1 kHz. It meets IPC 4202/1 requirements and carries a UL 94 V-0 flame rating. Like all Kapton® grades, it maintains its mechanical and dielectric performance across the full polyimide temperature range from −269 °C to +400 °C, covering everything from solder reflow to cryogenic service. It is specified across consumer electronics flex connectors, automotive sensor modules, avionics interconnects, industrial robotics cable chains, and HDI rigid-flex assemblies — wherever a polyimide substrate must flex dynamically, hold fine-pitch registration through thermal processing, and bond reliably to copper.