Kapton® CRC Polyimide Coil

Kapton® CRC Polyimide Coil is designed for low-power thermal management in flexible circuits, printed heaters, and embedded microelectronic systems. Its low thermal conductivity and stable polyimide composition enable precise heat localization in miniaturized devices. This makes it especially suited for research and laboratory use in thermal sensors, bioassays, and environmental testing platforms where localized, repeatable heating is needed. The material maintains mechanical and dimensional integrity under extended thermal cycling, supporting reliable integration into multilayer foil structures. Its compatibility with roll-to-roll and additive manufacturing processes allows efficient scaling for experimental and prototyping applications in flexible electronics and diagnostics.

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Tolerance

Properties

Reference & Citations

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Tolerances

Coil

Thickness		±20%

Material Properties for Polymers

Chemical Resistance

Element	Value
Acids - concentrated	Poor
Acids - dilute	Fair
Alcohols	Poor
Alkalis	Poor
Aromatic hydrocarbons	Good
Greases and Oils	Good
Halogenated Hydrocarbons	Good
Halogens	Fair
Ketones	Good

Mechanical Properties

Element	Value
Coefficient of friction	0.42
Hardness - Rockwell	E52-99
Elongation at break( % )	Aug-70
Tensile modulus( GPa )	2.0 – 3.0
Izod impact strength( J m⁻¹ )	80
Tensile strength( MPa )	70-150

Electrical Properties

Element	Value
Dielectric constant @1MHz	3.4
Dissipation factor @ 1kHz	0.0018
Dielectric strength( kV mm⁻¹ )	22
Surface resistivity( Ohm/sq )	10¹⁶
Volume resistivity( Ohmcm )	10¹⁸

Physical Properties

Element	Value
Flammability	V0
Radiation resistance	Good
Refractive index	1.66
Resistance to Ultra-violet	Poor
Limiting oxygen index( % )	53
Water absorption - over 24 hours( % )	0.2-2.9
Density( gcm⁻³ )	1.42

Thermal Properties

Element	Value
Heat-deflection temperature - 1.8MPa( C )	360
Lower working temperature( C )	-270
Upper working temperature( C )	250-320
Specific heat( J K⁻¹ kg⁻¹ )	1090
Thermal conductivity( W m⁻¹ K⁻¹ )	0.1-0.35@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	30-60