Kapton® 200RS100 Polyimide Coil

Kapton® 200RS100 Polyimide Coil integrates a polyimide substrate with a resistive heating element, offering precise and uniform thermal output in a thin, flexible format. Designed for research and laboratory use, it enables controlled heating in compact assemblies such as microfluidic devices, analytical instruments, and electronics enclosures. The coil maintains dimensional stability and electrical insulation across a wide temperature range, making it suitable for applications involving temperature-sensitive processes. Its low outgassing and compatibility with vacuum environments allow use in semiconductor testing, photonics, and aerospace component prototyping. The robust thermal response and ease of integration support reliable performance in iterative experimental setups.

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Tolerance

Properties

Reference & Citations

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Tolerances

Coil

Thickness		±20%

Material Properties for Polymers

Chemical Resistance

Element	Value
Acids - concentrated	Poor
Acids - dilute	Fair
Alcohols	Poor
Alkalis	Poor
Aromatic hydrocarbons	Good
Greases and Oils	Good
Halogenated Hydrocarbons	Good
Halogens	Fair
Ketones	Good

Mechanical Properties

Element	Value
Coefficient of friction	0.42
Hardness - Rockwell	E52-99
Elongation at break( % )	Aug-70
Tensile modulus( GPa )	2.0 – 3.0
Izod impact strength( J m⁻¹ )	80
Tensile strength( MPa )	70-150

Electrical Properties

Element	Value
Dielectric constant @1MHz	3.4
Dissipation factor @ 1kHz	0.0018
Dielectric strength( kV mm⁻¹ )	22
Surface resistivity( Ohm/sq )	10¹⁶
Volume resistivity( Ohmcm )	10¹⁸

Physical Properties

Element	Value
Flammability	V0
Radiation resistance	Good
Refractive index	1.66
Resistance to Ultra-violet	Poor
Limiting oxygen index( % )	53
Water absorption - over 24 hours( % )	0.2-2.9
Density( gcm⁻³ )	1.42

Thermal Properties

Element	Value
Heat-deflection temperature - 1.8MPa( C )	360
Lower working temperature( C )	-270
Upper working temperature( C )	250-320
Specific heat( J K⁻¹ kg⁻¹ )	1090
Thermal conductivity( W m⁻¹ K⁻¹ )	0.1-0.35@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	30-60