Copper Disk Single Crystal

Copper Disk Single Crystal is a precisely fabricated copper material with a single, continuous crystal lattice, ensuring uniform electrical, thermal, and mechanical properties across the entire disk. This structure eliminates grain boundaries, resulting in exceptional electrical conductivity, high thermal transport efficiency, and superior resistance to electromigration. It is widely employed in electronics, materials research, and microfabrication, particularly in high-precision sputtering targets, advanced semiconductor substrates, and nanoscale device development. Specific uses include deposition of high-purity copper thin films, interconnect studies in integrated circuits, and catalytic surface science experiments. In research, it provides a controlled platform for studying surface phenomena, electron transport, and crystal growth mechanisms. Scientifically and industrially, Copper Disk Single Crystal is valued for enabling the fabrication of components where defect-free conductivity, thermal stability, and surface precision are paramount.

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Tolerance

Properties

Reference & Citations

each

Tolerances

Single Crystal

Orientation		See Item
Thickness		+2% / -1%
Length		+2% / -1%

Disk

Diameter		+2% / -1%

Material Properties for Metals

Atomic Properties

Element	Value
Atomic number	29
Crystal structure	Face centred cubic
Electronic structure	Ar 3d¹⁰ 4s¹
Valences shown	1, 2
Atomic weight( amu )	63.546
Thermal neutron absorption cross-section( Barns )	3.8
Photo-electric work function( eV )	4.5
Natural isotope distribution( Mass No./% )	65/ 30.8
Natural isotope distribution( Mass No./% )	63/ 69.2
Atomic radius - Goldschmidt( nm )	0.128
Ionisation potential( No./eV )	4/ 55.2
Ionisation potential( No./eV )	6/ 103
Ionisation potential( No./eV )	1/ 7.73
Ionisation potential( No./eV )	5/ 79.9
Ionisation potential( No./eV )	3/ 36.8
Ionisation potential( No./eV )	2/ 20.29

Mechanical Properties

Element	Value
Material condition	Soft
Material condition	Hard
Poisson's ratio	0.343
Poisson's ratio	0.343
Bulk modulus( GPa )	137.8
Bulk modulus( GPa )	137.8
Tensile modulus( GPa )	129.8
Tensile modulus( GPa )	129.8
Izod toughness( J m⁻¹ )	68
Izod toughness( J m⁻¹ )	58
Hardness - Vickers( kgf mm⁻² )	87
Hardness - Vickers( kgf mm⁻² )	49
Tensile strength( MPa )	314
Tensile strength( MPa )	224
Yield strength( MPa )	270
Yield strength( MPa )	54

Electrical Properties

Element	Value
Electrical resistivity( µOhmcm )	1.69@20°C
Temperature coefficient( K⁻¹ )	0.0043@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV )	0.76

Physical Properties

Element	Value
Boiling point( C )	2567
Density( gcm⁻³ )	8.96@20°C

Thermal Properties

Element	Value
Melting point( C )	1083
Latent heat of evaporation( J g⁻¹ )	4796
Latent heat of fusion( J g⁻¹ )	205
Specific heat( J K⁻¹ kg⁻¹ )	385@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )	401@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	17@0-100°C