Copper Foil

Designed for precision and versatility, Goodfellow's Copper Foil combines high conductivity, thermal efficiency, and mechanical flexibility - making it ideal for electronics, energy storage, thermal management, and shielding applications. Produced from 99.9% to 99.9999% pure copper with ultra-tight thickness ranges (0.0005 mm to 3.25 mm), it integrates seamlessly into assemblies where performance and reliability are critical. Available in lengths up to 1200 mm and widths up to 1000 mm, with optional polishing and support layers, it suits both prototyping and production environments. Copper’s low electrical resistivity ensures efficient current flow in connectors, PCBs, and RF circuits, while its high thermal conductivity supports effective heat dissipation in demanding systems. Its ductility allows forming into ultra-thin, complex geometries without cracking, and its solderability and adhesive bonding ensure robust multilayer board assemblies. With natural EMI shielding properties and barrier performance against moisture and gases, our copper foil is trusted in flexible electronics, batteries, cable jacketing, and high-frequency signal systems.

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Tolerance

Properties

Reference & Citations

each

Tolerances

Foil

Thickness	<0.01mm	±25%
Thickness	0.01mm - 0.05mm	±15%
Thickness	>0.05mm	±10%

Material Properties for Metals

Atomic Properties

Element	Value
Atomic number	29
Crystal structure	Face centred cubic
Electronic structure	Ar 3d¹⁰ 4s¹
Valences shown	1, 2
Atomic weight( amu )	63.546
Thermal neutron absorption cross-section( Barns )	3.8
Photo-electric work function( eV )	4.5
Natural isotope distribution( Mass No./% )	65/ 30.8
Natural isotope distribution( Mass No./% )	63/ 69.2
Atomic radius - Goldschmidt( nm )	0.128
Ionisation potential( No./eV )	4/ 55.2
Ionisation potential( No./eV )	6/ 103
Ionisation potential( No./eV )	1/ 7.73
Ionisation potential( No./eV )	5/ 79.9
Ionisation potential( No./eV )	3/ 36.8
Ionisation potential( No./eV )	2/ 20.29

Mechanical Properties

Element	Value
Material condition	Soft
Material condition	Hard
Poisson's ratio	0.343
Poisson's ratio	0.343
Bulk modulus( GPa )	137.8
Bulk modulus( GPa )	137.8
Tensile modulus( GPa )	129.8
Tensile modulus( GPa )	129.8
Izod toughness( J m⁻¹ )	68
Izod toughness( J m⁻¹ )	58
Hardness - Vickers( kgf mm⁻² )	87
Hardness - Vickers( kgf mm⁻² )	49
Tensile strength( MPa )	314
Tensile strength( MPa )	224
Yield strength( MPa )	270
Yield strength( MPa )	54

Electrical Properties

Element	Value
Electrical resistivity( µOhmcm )	1.69@20@20°C
Temperature coefficient( K⁻¹ )	0.0043@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV )	0.76

Physical Properties

Element	Value
Boiling point( C )	2567
Density( gcm⁻³ )	8.96@20°C

Thermal Properties

Element	Value
Melting point( C )	1083
Latent heat of evaporation( J g⁻¹ )	4796
Latent heat of fusion( J g⁻¹ )	205
Specific heat( J K⁻¹ kg⁻¹ )	385@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )	401@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	17@0-100°C