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Copper Foil
Available Configurations
Properties common to all products in this list
| Purity | Thickness | Length | Width | Temper Options | Surface Finish Options | Support Options |
|---|---|---|---|---|---|---|
| 99.9% to 99.9999% | 0.0005mm to 3.25mm | 10mm to 1200mm | 10mm to 1000mm | As Rolled, Annealed, Half Hard, Hard | Polished on both sides, Mirror polished on both sides, Polished on one side to 0.1μm Ra or better | Permanent aluminium, Temporary acrylic |
Need custom configurations? Please contact our Technical Solutions team.
Key Features
Copper foil possesses a combination of material characteristics that make it particularly well suited for electronics, energy storage, thermal management, and industrial applications:
Very Low Electrical Resistivity (16.78 nΩ·m)
Copper is one of the most conductive metals, second only to silver. Its low resistivity ensures efficient current flow, making copper foil essential in printed circuit boards (PCBs), transformers, and high-frequency signal transmission systems.
High Thermal Conductivity (401 W/m·K)
Copper's ability to rapidly transfer heat makes it ideal for thermal management in electronics, batteries, and heat sinks. It helps prevent overheating and supports long-term device reliability.
Malleability & Ductility
Copper foil can be rolled into ultra-thin sheets and shaped into complex geometries without cracking. This enables its use in flexible electronics, wearable devices, and precision connectors.
Corrosion Resistance & Oxide Layer Protection
Copper naturally forms a thin oxide layer that protects against corrosion in dry environments. While less resistant than gold, treated copper foil (e.g., laminated or coated) performs well in industrial and electronic settings.
Electromagnetic Shielding & EMI/RFI Suppression
Copper foil is widely used to shield sensitive electronics from electromagnetic interference. Its conductivity and permeability make it effective in cable wraps, enclosures, and grounding systems.
Solderability & Bonding Compatibility
Copper's excellent wettability and compatibility with solders and adhesives support reliable integration into multilayer circuits and hybrid assemblies.
Barrier to Moisture and Gases
Copper foil provides effective barrier properties against water vapor and oxygen, especially when laminated or coated. This makes it valuable in flexible packaging, cable jacketing, and moisture-sensitive electronics.
Industrial Applications
High-purity copper foil is indispensable across modern industries due to its exceptional electrical and thermal conductivity, mechanical flexibility, and corrosion resistance:
- ✦ Printed Circuit Boards (PCBs)
- Copper foil is the foundational material in PCB manufacturing, forming the conductive traces that interconnect components in virtually all electronic devices. Its high conductivity and durability ensure reliable signal transmission and power distribution.
- ✦ Energy Storage & Batteries
- In lithium-ion and other advanced batteries, copper foil serves as the anode current collector. Its excellent conductivity and mechanical stability are critical for efficient energy transfer and long cycle life, especially in electric vehicles, grid storage systems, and portable electronics.
- ✦ Electromagnetic Interference (EMI) Shielding
- Copper foil is widely used in EMI/RFI shielding for sensitive electronics. It is applied in cable wraps, enclosures, and connectors to block electromagnetic interference, ensuring signal integrity in telecommunications, aerospace, and medical devices.
- ✦ Flexible & Wearable Electronics
- Owing to its ductility and fatigue resistance, copper foil is integral to flexible circuits used in foldable displays, wearable sensors, and medical patches. It maintains conductivity even under repeated bending and deformation.
- ✦ Thermal Management Systems
- Copper foil is employed in heat sinks, thermal interface materials, and vapor chambers to dissipate heat in high-performance electronics. Its superior thermal conductivity helps prevent overheating in CPUs, power modules, and LED systems.
- ✦ High-Frequency & RF Circuitry
- Rolled annealed and low-profile copper foils are used in high-frequency PCBs for 5G, radar, and microwave applications. Their smooth surface and low signal loss are essential for maintaining signal integrity at high data rates.
Mentions in Scientific Literature
Goodfellow's copper foil features prominently in research including but not exclusive to domains such as:
Electrochemical & Energy Systems, where it serves as a test electrode in lithium plating and stripping studies to evaluate the stability of the lithium-metal anode
[1]
.
Thermal Management & Heat Transfer, used as a test surface in boiling heat transfer experiments, often laser-textured to improve cooling in microelectronics and aerospace systems
[2]
.
Biomaterials & Medical Physics, used as a copper source in Ti-Cu-N thin film synthesis and as a reference material in X-ray spectrometry
[3–5]
.
Superconductivity & Power Systems, used as a substrate for high-temperature superconducting wires
[6]
.
Microscopy & Surface Characterization, used as a substrate for graphene growth and Al/Cu interfacial studies in advanced electron microscope research
[7–8]
.
Across these disciplines researchers have utilised our copper foils as high-purity
current collectors and anode substrates in electrochemical cells
[1]
, thermally conductive
test surfaces and heat transfer substrates
[2]
,
X-ray calibration standards for tissue-equivalent material development
[4–5]
,
superconductor substrates
[6]
, and
diffusion barrier layers and growth substrates in advanced surface characterisation
[7–8]
— applications that all benefit from copper's excellent electrical and thermal conductivity, uniform surface, and compatibility with advanced deposition and characterisation techniques.
References & Citations
Click to expand
- Younesi, R., & Bardé, F. (2017). Electrochemical performance and interfacial properties of Li-metal in lithium bis(fluorosulfonyl)imide based electrolytes. Scientific Reports, 7(1). https://doi.org/10.1038/s41598-017-16268-7
- Mertens, F., Nagarajan, B., Castagne, S., Steelant, J., & Vetrano, M. R. (2024). Novec 7000 flow boiling heat transfer enhancement via femtosecond laser texturing: impact of fluid degradation. CEAS Space Journal. https://doi.org/10.1007/s12567-024-00568-6
- Aziz, I., Emy Mulyani, & Yusuf, Y. (2023). Morphological, mechanical and antibacterial properties of Ti–Cu–N thin films deposited by sputtering DC. Heliyon, 9(6), e17170–e17170. https://doi.org/10.1016/j.heliyon.2023.e17170
- Juliana, Fernanda, Alexander, S., Santos, J. C., & de, M. (2024, October). Experimental determination of linear attenuation coefficients using a CdTe detector: application to breast tissue-equivalent materials. INIS – International Nuclear Information System; Sociedad Mexicana de Irradiacion y Dosimetria. https://inis.iaea.org/records/z2595-q1d13
- De, J., Nascimento, M., & De Janeiro, R. (2022). UNIVERSIDADE FEDERAL DO RIO DE JANEIRO INSTITUTO DE FÍSICA BACHARELADO EM FÍSICA MÉDICA Determinação de coeficientes mássicos de atenuação de materiais utilizando espectros de raios X polienergéticos. https://www.if.ufrj.br/wp-content/uploads/2025/03/JULIANA-DE-MOURA-NASCIMENTO.pdf
- Yust, N. A., Nekkanti, R., Brunke, L. B., Srinivasan, R., & Barnes, P. N. (2004). Copper metallic substrates for high temperature superconducting coated conductors. Superconductor Science and Technology, 18(1), 9–13. https://doi.org/10.1088/0953-2048/18/1/002
- Suri, A., Pratt, A., Tear, S., Walker, C., Kincal, C., Kamber, U., Gurlu, O., & El-Gomati, M. (2019). Analysis and detection of low-energy electrons in scanning electron microscopes using a Bessel box electron energy analyser. Journal of Electron Spectroscopy and Related Phenomena, 241, 146823. https://doi.org/10.1016/j.elspec.2019.02.002
- Martino, J., Benoit Duez, E., Goodyear, S., Président, C.-B.-L., Jacob, D., Rapporteur, A.-E.-D., Kadoun, U., Djilali, L., De Sidi, B.-A.-A., Directeur, L., Khouchaf, Mathieu, R., & Podor, R. (n.d.). N° d'ordre : MINES DOUAI CRP TUDOR FNR LUXEMBOURG UNIVERSITE DE LILLE 1. Retrieved July 22, 2025, from https://pepite-depot.univ-lille.fr/LIBRE/EDSMRE/2013/50376-2013-Zoukel.pdf
Synonyms
Material Properties
| Element | Value |
|---|---|
| Atomic number | 29 |
| Crystal structure | Face centred cubic |
| Electronic structure | Ar 3d¹⁰ 4s¹ |
| Valences shown | 1, 2 |
| Atomic weight( amu ) | 63.546 |
| Thermal neutron absorption cross-section( Barns ) | 3.8 |
| Photo-electric work function( eV ) | 4.5 |
| Natural isotope distribution( Mass No./% ) | 65/ 30.8 |
| Natural isotope distribution( Mass No./% ) | 63/ 69.2 |
| Atomic radius - Goldschmidt( nm ) | 0.128 |
| Ionisation potential( No./eV ) | 4/ 55.2 |
| Ionisation potential( No./eV ) | 6/ 103 |
| Ionisation potential( No./eV ) | 1/ 7.73 |
| Ionisation potential( No./eV ) | 5/ 79.9 |
| Ionisation potential( No./eV ) | 3/ 36.8 |
| Ionisation potential( No./eV ) | 2/ 20.29 |
| Element | Value |
|---|---|
| Material condition | Soft |
| Material condition | Hard |
| Poisson's ratio | 0.343 |
| Poisson's ratio | 0.343 |
| Bulk modulus( GPa ) | 137.8 |
| Bulk modulus( GPa ) | 137.8 |
| Tensile modulus( GPa ) | 129.8 |
| Tensile modulus( GPa ) | 129.8 |
| Izod toughness( J m⁻¹ ) | 68 |
| Izod toughness( J m⁻¹ ) | 58 |
| Hardness - Vickers( kgf mm⁻² ) | 87 |
| Hardness - Vickers( kgf mm⁻² ) | 49 |
| Tensile strength( MPa ) | 314 |
| Tensile strength( MPa ) | 224 |
| Yield strength( MPa ) | 270 |
| Yield strength( MPa ) | 54 |
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 1.69@20°C |
| Temperature coefficient( K⁻¹ ) | 0.0043@0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C)( mV ) | 0.76 |
| Element | Value |
|---|---|
| Boiling point( C ) | 2567 |
| Density( gcm⁻³ ) | 8.96@20°C |
| Element | Value |
|---|---|
| Melting point( C ) | 1083 |
| Latent heat of evaporation( J g⁻¹ ) | 4796 |
| Latent heat of fusion( J g⁻¹ ) | 205 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 385@25°C |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 401@0-100°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 17@0-100°C |
Tolerances
| Thickness | <0.01mm | ±25% |
|---|---|---|
| Thickness | 0.01mm - 0.05mm | ±15% |
| Thickness | >0.05mm | ±10% |