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Boron Nitride Sputtering Target

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Properties common to all products in this list

Composition: BN Form: Sputtering Target Material: Boron Nitride CAS Number: 10043-11-5 Commodity: Ceramics Thickness: 3mm Production Method: Hot Isostatic Pressed
Boron Nitride Sputtering Target is prized for producing coatings with exceptional thermal stability, electrical insulation, and chemical inertness, thanks to its robust B–N covalent bonds and ability to exist in both hexagonal and cubic phases. These targets enable the deposition of thin films with low dielectric constants, high hardness, and excellent oxidation resistance, even at elevated temperatures. Industries such as semiconductor manufacturing, optics, and tribology rely on boron nitride sputtering for precision-engineered protective and functional coatings. Notable applications include dielectric layers for microelectronic devices, wear-resistant coatings for cutting tools, and protective barriers in high-temperature optical systems. In research, the ability to tune crystalline phase and surface morphology via sputtering parameters drives innovation in nanoelectronics, photonics, and advanced barrier films. Its combination of versatility, performance, and stability ensures boron nitride sputtering targets remain a cornerstone for advanced thin-film fabrication in both industrial and scientific contexts.
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Material Properties

Chemical Resistance
Element Value
Acids - concentrated Fair
Acids - dilute Fair
Alkalis Fair
Halogens Poor
Metals Good
Electrical Properties
Element Value
Dielectric constant 4.3
Dielectric strength( kV mm⁻¹ ) 40-200
Volume resistivity( Ohmcm ) 10¹¹-10¹⁴@25
Physical Properties
Element Value
Apparent porosity( % ) 2-15
Density( gcm⁻³ ) 1.9-2.2
Thermal Properties
Element Value
Sublimation point( C ) 2600-2800
Upper continuous use temperature( C ) 950-2500
Specific heat( J K⁻¹ kg⁻¹ ) 800-2000@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 15-50@20°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 1-36@20-1000°C
Mechanical Properties
Element Value
Tensile modulus( GPa ) 20-35
Shear strength( MPa ) Dec-25
Pultrusions
Element Value
Compressive strength( MPa ) 30-120
each

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Available Configurations

Properties common to all products in this list

Composition: BN Form: Sputtering Target Material: Boron Nitride CAS Number: 10043-11-5 Commodity: Ceramics Thickness: 3mm Production Method: Hot Isostatic Pressed

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Tolerances

Sputtering Target
Thickness ±20%
Diameter ±0.5mm