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Boron Nitride Sputtering Target

Boron Nitride Sputtering Targets are used for thin film deposition techniques like magnetron sputtering. These high purity disks are available in 3 size variations. The hexagonal crystal structure of boron nitride gives them excellent thermal conductivity, electrical insulation and lubricity. Common applications include semiconductor device fabrication, hard protective coatings and thermally conductive fillers.
Formula: BN
Thickness: 3mm
Diameter: 76.2mm
Production Method: Hot Isostatic Pressed
CAS Number: 10043-11-5
UOM Code: 829-880-49
SKU: 1000035346
Product Code: B-60-ST-000100
Technical Data Sheet
Safety Data Sheet
$483.18
each
  • Buy 5 for $391.38 each and save 19%
  • Buy 10 for $357.55 each and save 26%
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Material Properties for Ceramics

Chemical Resistance
Element Value
Acids - concentrated Fair
Acids - dilute Fair
Alkalis Fair
Halogens Poor
Metals Good
Electrical Properties
Element Value
Dielectric constant 4.3
Dielectric strength( kV mm⁻¹ ) 40-200
Volume resistivity( Ohmcm ) 10¹¹-10¹⁴@25
Physical Properties
Element Value
Apparent porosity( % ) Feb-15
Density( gcm⁻³ ) 1.9-2.2
Thermal Properties
Element Value
Sublimation point( C ) 2600-2800
Upper continuous use temperature( C ) 950-2500
Specific heat( J K⁻¹ kg⁻¹ ) 800-2000@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 15-50@20°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 1-36@20-1000°C
Mechanical Properties
Element Value
Tensile modulus( GPa ) 20-35
Shear strength( MPa ) Dec-25
Pultrusions
Element Value
Compressive strength( MPa ) 30-120
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