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Formula: Bi
Form: Sputtering Target
Material: Bismuth
CAS Number: 7440-69-9
Commodity: Metals
Purity: 99.97%
Bismuth Sputtering Target offers high purity, controlled density, and excellent thermal stability, enabling the production of uniform thin films with desirable optical, electronic, and catalytic characteristics. These targets are critical in thin-film deposition technologies, particularly in magnetron sputtering and reactive sputtering processes. Key industries using them include optoelectronics, magneto-photonics, and photocatalysis. Specific uses encompass creating transparent heat-reflective coatings for energy-efficient glazing, fabricating magneto-optic garnet films for integrated optics and sensing, and depositing bismuth oxide layers for photocatalytic degradation of pollutants. Research continues to expand their role in tailoring film properties for next-generation devices, from photonic crystals to energy-harvesting surfaces. Their precision performance and adaptability ensure their relevance in high-tech manufacturing and advanced materials research.
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Material Properties for Metals

Atomic Properties
Element Value
Atomic number 83
Crystal structure Rhombohedral
Electronic structure Xe 4f¹⁴ 5d¹⁰ 6s² 6p³
Valences shown 3, 5
Atomic weight( amu ) 208.9804
Thermal neutron absorption cross-section( Barns ) 0.034
Photo-electric work function( eV ) 4.4
Atomic radius - Goldschmidt( nm ) 0.182
Ionisation potential( No./eV ) 5/ 56.0
Ionisation potential( No./eV ) 1/ 7.29
Ionisation potential( No./eV ) 3/ 25.6
Ionisation potential( No./eV ) 4/ 45.3
Ionisation potential( No./eV ) 6/ 88.3
Ionisation potential( No./eV ) 2/ 16.7
Mechanical Properties
Element Value
Material condition Polycrystalline
Poisson's ratio 0.33
Bulk modulus( GPa ) 31.3
Tensile modulus( GPa ) 34
Hardness - Vickers( kgf mm⁻² ) 16-19
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 117@20@20°C
Temperature coefficient( K⁻¹ ) 0.0046@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) -7.34
Physical Properties
Element Value
Boiling point( C ) 1560
Density( gcm⁻³ ) 9.8@20°C
Thermal Properties
Element Value
Melting point( C ) 271.3
Latent heat of evaporation( J g⁻¹ ) 857
Latent heat of fusion( J g⁻¹ ) 52
Specific heat( J K⁻¹ kg⁻¹ ) 124@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 7.9@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 13.4@0-100°C

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