Join us for World Space Week! Discover how Goodfellow's solutions address climate change from space.
A new 2D gold material with unique semiconductor and catalytic properties could pave the way for advancements in materials science and technology.
Mark, Adam and Aphrodite sit down this month to discuss the history of battery technology. From the ‘Baghdad Battery’ to conceptual ‘air batteries’, Goodfellow’s hosts cover applications from hearing aids to electric aircraft. You can get involved with the conversation on social media, or email marketing@goodfellow.com with any questions or topics you have for the next podcast episode.
Container Closure Integrity Testing (CCIT) helps ensure the safety of pharmaceutical packaging. We utilize laser drilling and micromachining systems to provide precision-calibrated leaks for CCIT in various materials.
Shadow masks guide light with high precision to an exact location through a stencil. We can fabricate holes as small as 1µm for mask features with maximum resolution.
Microfluidics leverage semiconductor manufacturing processes to perform complex molecular biology tasks more quickly and cheaply than with traditional methods.
Plasma treatment, UV/Ozone treatment, chemical treatment, and surfactant treatment can be used to change the hydrophilicity of COC and improve its microfluidic performance.
Organ-on-a-chip platforms are microfluidic devices that allow scientists to study different organ-specific responses to drug treatments. As such, they offer a viable alternative to animal testing and could help speed up the drug approval process. Goodfellow is able to help create miniaturization solutions with UV laser and micro-CNC micromachining. Our prototype to high volume production capability also creates prototypes that are Designed for Manufacturing, ensuring fast time to market and immediate scalability.
Silicon wafers serve as a fundamental component in various technologies and, following our acquisition of Potomac Photonics, we're leading the charge in their manufacturing and optimization. This industry front-runner has made significant strides in refining techniques for precise feature creation and hole drilling in silicon wafers, which includes wafer dicing and detailed patterning for diverse applications.
