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Formula: Nb
Form: Thin Film
Material: Niobium
CAS Number: 7440-03-1
Commodity: Metals
Purity: 99.9%
Thickness: 0.025µm
Area Density: 21µg/cm²
Support: Permanent Mylar® 3.5µm
Niobium Thin Film Disk is available in 2 variations. These disks consist of a layer of niobium deposited onto Mylar® polyester film. With excellent electrical conductivity and thermal stability, these disks have applications in electronics and telecommunications. The controlled thickness and uniformity of the niobium coating makes these disks ideal for research and development of thin film technologies across many industries.
Technical Data Sheet Safety Data Sheet Tolerance Properties
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Tolerances

Thin Film
Thickness ±30%
Disk
Diameter ±20%

Material Properties for Metals

Atomic Properties
Element Value
Atomic number 41
Crystal structure Body centred cubic
Electronic structure Kr 4d⁴ 5s¹
Valences shown 2, 3, 4, 5
Atomic weight( amu ) 92.9064
Thermal neutron absorption cross-section( Barns ) 1.15
Photo-electric work function( eV ) 4.3
Atomic radius - Goldschmidt( nm ) 0.147
Ionisation potential( No./eV ) 3/ 25.0
Ionisation potential( No./eV ) 2/ 14.3
Ionisation potential( No./eV ) 6/ 103
Ionisation potential( No./eV ) 1/ 6.88
Ionisation potential( No./eV ) 4/ 38.3
Ionisation potential( No./eV ) 5/ 50.5
Mechanical Properties
Element Value
Material condition Hard
Material condition Soft
Poisson's ratio 0.397
Poisson's ratio 0.397
Bulk modulus( GPa ) 170.3
Bulk modulus( GPa ) 170.3
Tensile modulus( GPa ) 104.9
Tensile modulus( GPa ) 104.9
Izod toughness( J m⁻¹ ) 10-120
Hardness - Vickers( kgf mm⁻² ) 115
Hardness - Vickers( kgf mm⁻² ) 160
Tensile strength( MPa ) 330
Tensile strength( MPa ) 585
Yield strength( MPa ) 550
Yield strength( MPa ) 240
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 16@20@20°C
Superconductivity critical temperature( K ) 9.25
Temperature coefficient( K⁻¹ ) 0.0026@0-100°C
Physical Properties
Element Value
Boiling point( C ) 4742
Density( gcm⁻³ ) 8.57@20°C
Thermal Properties
Element Value
Melting point( C ) 2468
Latent heat of evaporation( J g⁻¹ ) 7360
Latent heat of fusion( J g⁻¹ ) 290
Specific heat( J K⁻¹ kg⁻¹ ) 268@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 53.7@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 7.2@0-100°C

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