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Aluminum Nitride Sputtering Target

Formula: AlN
Form: Sputtering Target
Material: Aluminum Nitride
CAS Number: 24304-00-5
Commodity: Compounds
Diameter: 50mm
Aluminum Nitride Sputtering Targets are part our wide range of ceramic sputtering target materials. Available in 2 variations, these high purity aluminum nitride disks feature exceptional thermal conductivity, electrical resistivity and hardness. With applications in microelectronics, optoelectronics, and photovoltaics, they enable precise thin film deposition for advanced semiconductor devices, LEDs, laser diodes and solar cells. The uniform composition and dense structure of these sputtering targets make them ideal for producing smooth, defect-free nitride films using magnetron sputtering or ion beam deposition.
Technical Data Sheet Safety Data Sheet Tolerance Properties
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Material Properties for Compounds

Physical Properties
Element Value
Density( gcm⁻³ ) 3.26

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