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Formula: WSi₂
Form: Sputtering Target
Material: Tungsten Silicide
CAS Number: 12039-88-2
Commodity: Compounds
Thickness:
3mm
Diameter:
50.8mm
Tungsten Silicide Sputtering Targets are a high-performance material with a high melting point and excellent conductivity. These properties make tungsten silicide valued for thin film deposition applications like microelectronics fabrication. These precision-engineered targets enable efficient, uniform coatings in semiconductor production and related manufacturing.
Material Properties for Compounds
Physical Properties
| Element | Value |
|---|---|
| Density( gcm⁻³ ) | 9.4 |