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Formula: WSi₂
Form: Sputtering Target
Material: Tungsten Silicide
CAS Number: 12039-88-2
Commodity: Compounds
Thickness: 3mm
Diameter: 50.8mm

Tungsten Silicide Sputtering Target

Tungsten Silicide Sputtering Targets are a high-performance material with a high melting point and excellent conductivity. These properties make tungsten silicide valued for thin film deposition applications like microelectronics fabrication. These precision-engineered targets enable efficient, uniform coatings in semiconductor production and related manufacturing.
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Material Properties for Compounds

Physical Properties
Element Value
Density( gcm⁻³ ) 9.4

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