Titanium Silicide Powder

Goodfellow's Titanium Silicide Powder is an advanced intermetallic compound known for its unique combination of low electrical resistivity and high-temperature stability. This powder consists of fine particles of titanium silicide, typically in the form of TiSi2, which exhibits excellent thermal and chemical stability, low contact resistance, and good compatibility with silicon-based semiconductors. Its ability to form stable, low-resistance contacts with silicon makes it particularly valuable in microelectronics applications. Titanium Silicide Powder finds extensive use in the semiconductor industry, particularly in the fabrication of integrated circuits. It serves as a crucial material for creating low-resistance contacts and interconnects in CMOS (Complementary Metal-Oxide-Semiconductor) devices, enhancing their performance and reliability. In materials science research, it's explored as a model system for studying silicide formation and properties. Cutting-edge research investigates its potential in developing advanced thermoelectric materials and as a component in high-temperature structural materials for aerospace applications. The unique properties of Titanium Silicide Powder make it a focus of ongoing research and development efforts in fields such as microelectronics, materials engineering, and energy conversion technologies. Its significance in both industrial semiconductor manufacturing and scientific investigations underscores its importance in advancing technologies that require materials with exceptional electrical and thermal properties at the nanoscale.