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Formula: Ta
Form: Sputtering Target
Material: Tantalum
CAS Number: 7440-25-7
Commodity: Metals
Purity: 99.9%
Tantalum Sputtering Targets are available in 8 variations with a choice of sizes and orientations to accommodate different sputtering system configurations. These high-purity tantalum disks are ideal for thin film deposition applications like semiconductor device fabrication, optical coatings and the surface modification of materials. Tantalum's high melting point, good electrical conductivity and chemical inertness make it a versatile sputtering target material for both research and industrial applications.
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Material Properties for Metals

Atomic Properties
Element Value
Atomic number 73
Crystal structure Body centred cubic
Electronic structure Xe 4f¹⁴ 5d³ 6s²
Valences shown 2,3,4,5
Atomic weight( amu ) 180.9479
Thermal neutron absorption cross-section( Barns ) 22
Photo-electric work function( eV ) 4.1
Natural isotope distribution( Mass No./% ) 180/ 0.012
Natural isotope distribution( Mass No./% ) 181/ 99.988
Atomic radius - Goldschmidt( nm ) 0.147
Ionisation potential( No./eV ) 1/ 7.88
Ionisation potential( No./eV ) 2/ 16.2
Mechanical Properties
Element Value
Material condition Hard
Material condition Soft
Poisson's ratio 0.342
Poisson's ratio 0.342
Bulk modulus( GPa ) 196.3
Bulk modulus( GPa ) 196.3
Tensile modulus( GPa ) 185.7
Tensile modulus( GPa ) 185.7
Hardness - Vickers( kgf mm⁻² ) 200
Hardness - Vickers( kgf mm⁻² ) 90
Tensile strength( MPa ) 760
Tensile strength( MPa ) 172-207
Yield strength( MPa ) 705
Yield strength( MPa ) 310-380
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 13.5@20@20°C
Superconductivity critical temperature( K ) 4.47
Temperature coefficient( K⁻¹ ) 0.0035@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) 0.33
Physical Properties
Element Value
Boiling point( C ) 5425
Density( gcm⁻³ ) 16.6@20°C
Thermal Properties
Element Value
Melting point( C ) 2996
Latent heat of evaporation( J g⁻¹ ) 4165
Latent heat of fusion( J g⁻¹ ) 174
Specific heat( J K⁻¹ kg⁻¹ ) 140@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 57.5@0-100
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 6.5@0-100°C

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