Tantalum Sputtering Target

Tantalum Sputtering Targets are available in 8 variations with a choice of sizes and orientations to accommodate different sputtering system configurations. These high-purity tantalum disks are ideal for thin film deposition applications like semiconductor device fabrication, optical coatings and the surface modification of materials. Tantalum's high melting point, good electrical conductivity and chemical inertness make it a versatile sputtering target material for both research and industrial applications.

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Properties

Reference & Citations

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1000068343

3mm

25.4mm

1000139606

6mm

25.4mm

1000160934

3mm

25mm

1000211143

2mm

50mm

$156.38each
5+ for $126.67ea
10+ for $115.72ea

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$211.40each
5+ for $171.23ea
10+ for $156.44ea

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$231.88each
5+ for $187.83ea
10+ for $171.59ea

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$243.26each
5+ for $197.04ea
10+ for $180.01ea

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Material Properties for Metals

Atomic Properties

Element	Value
Atomic number	73
Crystal structure	Body centred cubic
Electronic structure	Xe 4f¹⁴ 5d³ 6s²
Valences shown	2,3,4,5
Atomic weight( amu )	180.9479
Thermal neutron absorption cross-section( Barns )	22
Photo-electric work function( eV )	4.1
Natural isotope distribution( Mass No./% )	180/ 0.012
Natural isotope distribution( Mass No./% )	181/ 99.988
Atomic radius - Goldschmidt( nm )	0.147
Ionisation potential( No./eV )	1/ 7.88
Ionisation potential( No./eV )	2/ 16.2

Mechanical Properties

Element	Value
Material condition	Hard
Material condition	Soft
Poisson's ratio	0.342
Poisson's ratio	0.342
Bulk modulus( GPa )	196.3
Bulk modulus( GPa )	196.3
Tensile modulus( GPa )	185.7
Tensile modulus( GPa )	185.7
Hardness - Vickers( kgf mm⁻² )	200
Hardness - Vickers( kgf mm⁻² )	90
Tensile strength( MPa )	760
Tensile strength( MPa )	172-207
Yield strength( MPa )	705
Yield strength( MPa )	310-380

Electrical Properties

Element	Value
Electrical resistivity( µOhmcm )	13.5@20@20°C
Superconductivity critical temperature( K )	4.47
Temperature coefficient( K⁻¹ )	0.0035@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV )	0.33

Physical Properties

Element	Value
Boiling point( C )	5425
Density( gcm⁻³ )	16.6@20°C

Thermal Properties

Element	Value
Melting point( C )	2996
Latent heat of evaporation( J g⁻¹ )	4165
Latent heat of fusion( J g⁻¹ )	174
Specific heat( J K⁻¹ kg⁻¹ )	140@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )	57.5@0-100
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	6.5@0-100°C