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Tantalum Spooled Wire
Available Configurations
Properties common to all products in this list
| Diameter | Length | Temper ⓘ | Other Variant |
|---|---|---|---|
| 0.025 mm to 1.5 mm | 0.1 m to 1000 m | Annealed As Drawn |
Straight wire |
Need custom configurations? Please contact us.
Key Features
Tantalum Spooled Wire is available in annealed and as-drawn tempers, combining one of the highest melting points of any commercially available metal with near-universal chemical inertness and well-documented biocompatibility:
Melting Point 2,996 °C
With a melting point of 2,996 °C, tantalum wire maintains structural integrity and chemical stability in high-temperature environments that exceed the capability of most other metals, supporting its use as a heating element in reducing atmospheres and as a refractory substrate in demanding research applications.
Near-Universal Chemical Inertness
Tantalum resists attack by virtually all acids with the exception of hydrofluoric acid and fuming sulfuric acid, and forms a stable self-passivating oxide that gives it a corrosion resistance profile approaching that of the platinum group metals in many industrial environments.
Well-Documented Biocompatibility
Biocompatibility is confirmed across cardiovascular, orthopaedic, dental, and spinal fusion implant applications, where tantalum’s corrosion resistance, osseointegration capability, and radiopacity make it one of the most biologically inert structural metals available for implantable device wire.
Two Tempers for Forming and Structural Applications
The annealed temper provides maximum ductility for forming and winding operations. The as-drawn temper gives greater mechanical strength for structural wire applications requiring higher load-bearing capability.
Stable Self-Passivating Oxide
The spontaneously forming tantalum oxide layer is stable and self-repairing, providing reliable corrosion protection that is maintained even when the wire surface is damaged or deformed during fabrication.
Industrial Applications
Tantalum Spooled Wire is used across chemical processing, biomedical device fabrication, high-temperature research, and surface science wherever near-universal chemical inertness and biocompatibility determine material selection:
- ✦ Chemical Processing Reactor Lining and Heat Exchanger Wire
- Used as reactor lining wire and heat exchanger elements in aggressive acid service environments, where tantalum’s resistance to virtually all mineral acids ensures long service life in process conditions that would rapidly degrade stainless steel and most other metallic materials.
- ✦ Implantable Device Wire and Biomedical Applications
- Applied as wire for implantable device components across cardiovascular, orthopaedic, dental, and spinal fusion applications, where confirmed biocompatibility, osseointegration capability, and radiopacity meet the biological and imaging requirements of implant systems.
- ✦ High-Temperature Furnace Elements in Reducing Atmospheres
- Used as heating element wire in high-temperature furnaces operating in reducing atmospheres, where the 2,996 °C melting point and chemical stability in non-oxidizing environments support sustained high-temperature operation.
- ✦ Sputtering Target Fabrication
- Applied as feedstock for sputtering target fabrication, where tantalum’s chemical purity, high melting point, and consistent material properties support reliable, reproducible tantalum thin-film deposition.
- ✦ Surface Science Studies of Oxide Passivation and Corrosion Behavior
- Used in surface science research as a chemically inert, refractory substrate for investigations into oxide passivation mechanisms and corrosion behavior in refractory transition metals, where the stable self-passivating oxide is itself a subject of study.
Material Properties
| Element | Value |
|---|---|
| Atomic number | 73 |
| Crystal structure | Body centred cubic |
| Electronic structure | Xe 4f¹⁴ 5d³ 6s² |
| Valences shown | 2,3,4,5 |
| Atomic weight( amu ) | 180.9479 |
| Thermal neutron absorption cross-section( Barns ) | 22 |
| Photo-electric work function( eV ) | 4.1 |
| Natural isotope distribution( Mass No./% ) | 180/ 0.012 |
| Natural isotope distribution( Mass No./% ) | 181/ 99.988 |
| Atomic radius - Goldschmidt( nm ) | 0.147 |
| Ionisation potential( No./eV ) | 1/ 7.88 |
| Ionisation potential( No./eV ) | 2/ 16.2 |
| Element | Value |
|---|---|
| Material condition | Hard |
| Material condition | Soft |
| Poisson's ratio | 0.342 |
| Poisson's ratio | 0.342 |
| Bulk modulus( GPa ) | 196.3 |
| Bulk modulus( GPa ) | 196.3 |
| Tensile modulus( GPa ) | 185.7 |
| Tensile modulus( GPa ) | 185.7 |
| Hardness - Vickers( kgf mm⁻² ) | 200 |
| Hardness - Vickers( kgf mm⁻² ) | 90 |
| Tensile strength( MPa ) | 760 |
| Tensile strength( MPa ) | 172-207 |
| Yield strength( MPa ) | 705 |
| Yield strength( MPa ) | 310-380 |
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 13.5@20°C |
| Superconductivity critical temperature( K ) | 4.47 |
| Temperature coefficient( K⁻¹ ) | 0.0035@0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C)( mV ) | 0.33 |
| Element | Value |
|---|---|
| Boiling point( C ) | 5425 |
| Density( gcm⁻³ ) | 16.6@20°C |
| Element | Value |
|---|---|
| Melting point( °C ) | 3017 |
| Latent heat of evaporation( J g⁻¹ ) | 4165 |
| Latent heat of fusion( J g⁻¹ ) | 174 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 140@25°C |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 57.5@0-100 |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 6.5@0-100°C |
Tolerances
| Diameter | ±10% | |
|---|---|---|
| Length | +5% / -1% |