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Grade: Semi-conducting
Formula: FKM carbon black filled
Form: Disk
Material: Hexafluoropropylene (HFP)
Commodity: Polymers
Thickness: 3mm
Diameter: 50.8mm
Color: Black

Semi-conducting PVDF-HFP Disk

Semi-Conducting PVDF-HFP Disk combines the flexibility of polyvinylidene fluoride-hexafluoropropylene with semiconducting performance, providing a unique platform for energy harvesting, sensing, and wearable device integration. Its high dielectric constant, mechanical toughness, and chemical stability make it suitable for electronics, biomedical engineering, and advanced sensor technologies. Applications include piezoelectric nanogenerators, electroactive scaffolds, and high-durability capacitor elements, where the disk geometry ensures reproducible contact surfaces and efficient electrical response. Research leverages this material in low-power electronics, human motion sensors, and hybrid generator systems, benefiting from its compatibility with nanocomposite enhancements. The disk form supports standardized integration into electrochemical studies, pressure sensors, and optoelectronic systems. Its dual role as a structural element and functional semiconductor underscores its value for both industrial applications and next-generation research on flexible and adaptive electronics.
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Tolerances

Disk
Thickness ±20%

Material Properties for Polymers

Chemical Resistance
Element Value
Acids - concentrated Good-Fair
Acids - dilute Good
Alcohols Good-Fair
Alkalis Good-Fair
Aromatic hydrocarbons Good-Fair
Greases and Oils Good-Fair
Halogenated Hydrocarbons Good-Fair
Halogens Good
Ketones Poor
Physical Properties
Element Value
Flammability Self Extinguishing
Radiation resistance Poor
Resistance to Ultra-violet Excellent
Density( gcm⁻³ ) 2
Mechanical Properties
Element Value
Hardness - Rockwell Shore A75
Compression set after 24 hr at 175C( % ) 43
Elongation at break( % ) 200
Tensile strength( MPa ) 9
Tear strength( N mm⁻¹ ) 10
Thermal Properties
Element Value
Lower working temperature( C ) 40
Upper working temperature( C ) 220-300
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.3@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 160

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