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Formula: PS
Form: Disk
Material: Polystyrene (PS)
CAS Number: 9003-53-6
Commodity: Polymers
Structure: Biaxially Oriented
Polystyrene Disk is a machined form of polystyrene (PS), a lightweight, amorphous thermoplastic noted for its rigidity, ease of processing, and excellent optical clarity. In disk form, it provides a stable, dimensionally consistent substrate for applications requiring transparency and precision shaping. Industries including optics, biomedical devices, and microfabrication employ polystyrene disks for prototyping, optical windows, and labware components. Specific applications include use as substrates for thin film deposition, transparent holders in microscopy setups, and components in diagnostic equipment. In research, polystyrene disks are investigated for surface modification, interaction with solvents, and use as model polymer substrates for adhesion and coating studies. Their balance of mechanical stability, low cost, and optical clarity ensures they remain an essential material for scientific experiments and industrial prototyping where predictable performance and transparency are required.
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Tolerances

Disc
Thickness ±20%

Material Properties for Polymers

Physical Properties
Element Value
Abbe number 30.8
Flammability HB
Radiation resistance Good
Refractive index 1.59-1.6
Resistance to Ultra-violet Poor
Limiting oxygen index( % ) 19
Water absorption - over 24 hours( % ) 0.4
Density( gcm⁻³ ) 1.05
Chemical Resistance
Element Value
Acids - concentrated Fair-Poor
Acids - dilute Good-Fair
Alcohols Good-Fair
Alkalis Good-Fair
Aromatic hydrocarbons Poor
Greases and Oils Good-Poor
Halogenated Hydrocarbons Poor
Halogens Poor
Ketones Poor
Electrical Properties
Element Value
Dielectric constant @1MHz 2.4-3.1
Dissipation factor @ 1kHz 0.0002
Dielectric strength( kV mm⁻¹ ) 20
Volume resistivity( Ohmcm ) >10¹⁶
Mechanical Properties
Element Value
Hardness - Rockwell M60-90
Poisson's ratio 0.35
Elongation at break( % ) 1.6
Tensile modulus( GPa ) 2.3-4.1
Izod impact strength( J m⁻¹ ) 19-24
Tensile strength( MPa ) 30-100
Thermal Properties
Element Value
Heat-deflection temperature - 0.45MPa( C ) 90
Heat-deflection temperature - 1.8MPa( C ) 80
Upper working temperature( C ) 50-95
Specific heat( J K⁻¹ kg⁻¹ ) 1200
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.1-0.13@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 30-210

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