Cross-Linked Polystyrene Film

Cross-Linked Polystyrene Film, based on polystyrene, is a polymeric material that achieves enhanced mechanical and thermal stability through a cross-linked network structure. In thin-film form, it exhibits high dimensional stability, resistance to solvents, and improved thermal endurance compared to standard polystyrene films. Industries such as microelectronics, packaging, and advanced coatings employ cross-linked PS film for insulating layers, barrier films, and protective coatings. Specific applications include dielectric layers in printed circuit boards, solvent-resistant membranes in laboratory filtration, and protective coatings in microfabrication. In research, cross-linked PS films are investigated for thermal degradation mechanisms, surface modification for improved adhesion, and role as a model polymer in thin-film studies. Their balance of mechanical rigidity, thermal stability, and processing versatility makes them crucial in applications requiring strong, stable polymer films.

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Tolerance

Properties

Reference & Citations

each

Tolerances

Foil/Film/Sheet

Thickness		±20%

Material Properties for Polymers

Chemical Resistance

Element	Value
Acids - concentrated	Fair-Poor
Acids - dilute	Good(-Fair?)
Alcohols	Good(-Fair?)
Alkalis	Good-Fair
Aromatic hydrocarbons	Poor
Greases and Oils	Fair-Poor
Halogenated Hydrocarbons	Poor
Halogens	Poor
Ketones	Poor

Electrical Properties

Element	Value
Dielectric constant @1MHz	2.5
Dissipation factor @ 1MHz	0.0002
Dielectric strength( kV mm⁻¹ )	27-47
Surface resistivity( Ohm/sq )	>10¹⁵
Volume resistivity( Ohmcm )	>10¹⁵

Physical Properties

Element	Value
Flammability	HB
Radiation resistance	Good
Refractive index	1.59
Water absorption - over 24 hours( % )	0.02-0.03
Density( gcm⁻³ )	1.05

Mechanical Properties

Element	Value
Hardness - Rockwell	R110-120
Elongation at break( % )	03-May
Tensile modulus( GPa )	1.65
Abrasive resistance - ASTM D1044( mg/1000 cycles )	60-100
Tensile strength( MPa )	55-70