Polystyrene Film

Polystyrene Film, composed of polystyrene (PS), offers optical clarity, rigidity, and chemical resistance in a versatile thin-film format. Its low moisture absorption and excellent dielectric properties make it useful in electronics, optics, and biomedical applications. Industries employ Polystyrene films in microfluidic devices, disposable labware, and optical windows, as well as in dielectric layers for capacitors and packaging for sensitive electronics. Research applications include thin-film photonics, surface patterning, and polymer physics studies, where Polystyrene films provide consistent thickness and optical performance. The film geometry supports scalable coating and lamination processes, enabling integration into large-area devices and multilayer composites. By combining transparency with functional robustness, Polystyrene films remain essential in advancing applications ranging from diagnostics and energy devices to high-resolution optical research systems.

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Tolerance

Properties

Reference & Citations

each

Tolerances

Foil

Thickness		±20%

Material Properties for Polymers

Physical Properties

Element	Value
Abbe number	30.8
Flammability	HB
Radiation resistance	Good
Refractive index	1.59-1.6
Resistance to Ultra-violet	Poor
Limiting oxygen index( % )	19
Water absorption - over 24 hours( % )	0.4
Density( gcm⁻³ )	1.05

Chemical Resistance

Element	Value
Acids - concentrated	Fair-Poor
Acids - dilute	Good-Fair
Alcohols	Good-Fair
Alkalis	Good-Fair
Aromatic hydrocarbons	Poor
Greases and Oils	Good-Poor
Halogenated Hydrocarbons	Poor
Halogens	Poor
Ketones	Poor

Electrical Properties

Element	Value
Dielectric constant @1MHz	2.4-3.1
Dissipation factor @ 1kHz	0.0002
Dielectric strength( kV mm⁻¹ )	20
Volume resistivity( Ohmcm )	>10¹⁶

Mechanical Properties

Element	Value
Hardness - Rockwell	M60-90
Poisson's ratio	0.35
Elongation at break( % )	1.6
Tensile modulus( GPa )	2.3-4.1
Izod impact strength( J m⁻¹ )	19-24
Tensile strength( MPa )	30-100

Thermal Properties

Element	Value
Heat-deflection temperature - 0.45MPa( C )	90
Heat-deflection temperature - 1.8MPa( C )	80
Upper working temperature( C )	50-95
Specific heat( J K⁻¹ kg⁻¹ )	1200
Thermal conductivity( W m⁻¹ K⁻¹ )	0.1-0.13@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	30-210