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Formula: Polymetaphenylene isophthalamide
Form: Honeycomb Panel
Material: Polyaramid
Commodity: Polymers
Polyaramid Honeycomb Panel offers a unique combination of extreme strength-to-weight ratio, thermal stability, and structural rigidity, engineered in a honeycomb core configuration cut to specified dimensions. The polyaramid core resists deformation under compressive loads and maintains stability across a wide temperature range, making it a preferred choice for aerospace fuselage sections, satellite structures, and high-performance marine craft. Applications include aircraft flooring panels, automotive impact structures, and vibration-damping inserts in precision instruments. Research uses involve testing advanced sandwich composites, optimizing energy absorption mechanisms, and developing lightweight thermal protection systems. The combination of honeycomb architecture with polyaramid’s inherent mechanical and thermal resilience delivers a lightweight yet robust solution for demanding engineering environments.
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Tolerances

Honeycomb Panel
Thickness Nominal
Other All other dimesions are Nominal

Material Properties for Polymers

Chemical Resistance
Element Value
Acids - concentrated Poor
Acids - dilute Good-Fair
Alcohols Good
Alkalis Good-Poor
Aromatic hydrocarbons Good
Greases and Oils Good
Halogenated Hydrocarbons Good
Ketones Good
Electrical Properties
Element Value
Dielectric constant @1kHz 2.3
Dielectric strength( kV mm⁻¹ ) 32
Volume resistivity( Ohmcm ) 6x10¹⁶
Physical Properties
Element Value
Radiation resistance Good
Limiting oxygen index( % ) 29
Water absorption - equilibrium( % ) 9
Water absorption - over 24 hours( % ) 0.08
Density( gcm⁻³ ) 1.38
Mechanical Properties
Element Value
Elongation at break( % ) 9
Izod impact strength( J m⁻¹ ) 533unnotched
Tensile strength( MPa ) 1800-3900
Thermal Properties
Element Value
Heat-deflection temperature - 1.8MPa( C ) 149
Upper working temperature( C ) 200-300
Specific heat( J K⁻¹ kg⁻¹ ) 1200
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.13@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 20

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