Images are for guidance only and might not represent the final product.

Polyaramid Film (Polymetaphenylene isophthalamide)

Available Configurations

Properties common to all products in this list

Commodity: Polymers Material: Polyaramid Form: Foil/Film/Sheet Composition: Polymetaphenylene isophthalamide
Polyaramid Film (Polymetaphenylene Isophthalamide) offers high thermal stability, flame resistance, and chemical durability in a thin, flexible format. This film geometry is used extensively in insulation, flexible barriers, and structural laminates. Industries including aerospace, electrical, and automotive sectors rely on it for high-temperature insulation tapes, flexible circuit substrates, and protective barriers in composite structures. Specific applications include slot liners for electric motors, flexible thermal barriers in spacecraft, and chemically resistant laminates in automotive assemblies. In research, the film is integral for studies on dielectric breakdown in thin polymers, thermal degradation kinetics, and interlaminar bonding in composites. Its combination of inherent polymer strength and form adaptability ensures ongoing relevance in high-performance designs.
Starting at $210.00 each
No Minimum order Free technical support *Free delivery worldwide

Material Properties

Chemical Resistance
Element Value
Acids - concentrated Poor
Acids - dilute Good-Fair
Alcohols Good
Alkalis Good-Poor
Aromatic hydrocarbons Good
Greases and Oils Good
Halogenated Hydrocarbons Good
Ketones Good
Electrical Properties
Element Value
Dielectric constant @1kHz 2.3
Dielectric strength( kV mm⁻¹ ) 32
Volume resistivity( Ohmcm ) 6x10¹⁶
Physical Properties
Element Value
Radiation resistance Good
Limiting oxygen index( % ) 29
Water absorption - equilibrium( % ) 9
Water absorption - over 24 hours( % ) 0.08
Density( gcm⁻³ ) 1.38
Mechanical Properties
Element Value
Elongation at break( % ) 9
Izod impact strength( J m⁻¹ ) 533unnotched
Tensile strength( MPa ) 1800-3900
Thermal Properties
Element Value
Heat-deflection temperature - 1.8MPa( C ) 149
Upper working temperature( C ) 200-300
Specific heat( J K⁻¹ kg⁻¹ ) 1200
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.13@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 20
each

Choose Your Options

Close

Available Configurations

Properties common to all products in this list

Commodity: Polymers Material: Polyaramid Form: Foil Composition: Polymetaphenylene isophthalamide

We are collecting your products, please wait!...

Shipping restrictions and charges may apply for some hazardous materials.

Tolerances

Foil
Thickness ±20%