Polyaramid Film (Polymetaphenylene isophthalamide)

Polyaramid Film (Polymetaphenylene Isophthalamide) offers high thermal stability, flame resistance, and chemical durability in a thin, flexible format. This film geometry is used extensively in insulation, flexible barriers, and structural laminates. Industries including aerospace, electrical, and automotive sectors rely on it for high-temperature insulation tapes, flexible circuit substrates, and protective barriers in composite structures. Specific applications include slot liners for electric motors, flexible thermal barriers in spacecraft, and chemically resistant laminates in automotive assemblies. In research, the film is integral for studies on dielectric breakdown in thin polymers, thermal degradation kinetics, and interlaminar bonding in composites. Its combination of inherent polymer strength and form adaptability ensures ongoing relevance in high-performance designs.

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Tolerance

Properties

Reference & Citations

each

Tolerances

Foil

Thickness		±20%

Material Properties for Polymers

Chemical Resistance

Element	Value
Acids - concentrated	Poor
Acids - dilute	Good-Fair
Alcohols	Good
Alkalis	Good-Poor
Aromatic hydrocarbons	Good
Greases and Oils	Good
Halogenated Hydrocarbons	Good
Ketones	Good

Electrical Properties

Element	Value
Dielectric constant @1kHz	2.3
Dielectric strength( kV mm⁻¹ )	32
Volume resistivity( Ohmcm )	6x10¹⁶

Physical Properties

Element	Value
Radiation resistance	Good
Limiting oxygen index( % )	29
Water absorption - equilibrium( % )	9
Water absorption - over 24 hours( % )	0.08
Density( gcm⁻³ )	1.38

Mechanical Properties

Element	Value
Elongation at break( % )	9
Izod impact strength( J m⁻¹ )	533unnotched
Tensile strength( MPa )	1800-3900

Thermal Properties

Element	Value
Heat-deflection temperature - 1.8MPa( C )	149
Upper working temperature( C )	200-300
Specific heat( J K⁻¹ kg⁻¹ )	1200
Thermal conductivity( W m⁻¹ K⁻¹ )	0.13@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	20