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Grade: DuPont™ Nomex® T992 - Low Density Pressboard
Formula: Polymetaphenylene isophthalamide
Form: Foil/Film/Sheet
Material: Polyaramide
Commodity: Polymers
Thickness:
1.5mm
Type:
Pressboard
DuPont™ Nomex® T992 is a low density pressboard polyaramid film from Goodfellow's range of polymetaphenylene isophthalamide films. This product exhibits high thermal, mechanical, and chemical stability. Nomex® pressboard has low flammability and is self-extinguishing, making it suitable for electrical insulation applications. It also has very low moisture absorption, allowing it to retain its dielectric properties in humid conditions. Potential applications include electrical insulation, honeycomb structures, and high temperature filtration.
Tolerances
Foil/Film/Sheet
| Thickness | ±20% |
|---|
Material Properties for Polymers
Chemical Resistance
| Element | Value |
|---|---|
| Acids - concentrated | Poor |
| Acids - dilute | Good-Fair |
| Alcohols | Good |
| Alkalis | Good-Poor |
| Aromatic hydrocarbons | Good |
| Greases and Oils | Good |
| Halogenated Hydrocarbons | Good |
| Ketones | Good |
Electrical Properties
| Element | Value |
|---|---|
| Dielectric constant @1kHz | 2.3 |
| Dielectric strength( kV mm⁻¹ ) | 32 |
| Volume resistivity( Ohmcm ) | 6x10¹⁶ |
Physical Properties
| Element | Value |
|---|---|
| Radiation resistance | Good |
| Limiting oxygen index( % ) | 29 |
| Water absorption - equilibrium( % ) | 9 |
| Water absorption - over 24 hours( % ) | 0.08 |
| Density( gcm⁻³ ) | 1.38 |
Mechanical Properties
| Element | Value |
|---|---|
| Elongation at break( % ) | 9 |
| Izod impact strength( J m⁻¹ ) | 533unnotched |
| Tensile strength( MPa ) | 1800-3900 |
Thermal Properties
| Element | Value |
|---|---|
| Heat-deflection temperature - 1.8MPa( C ) | 149 |
| Upper working temperature( C ) | 200-300 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 1200 |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 0.13@23°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 20 |
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