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Formula: Polymetaphenylene isophthalamide
Form: Disk
Material: Polyaramid
Commodity: Polymers

Polyaramid Disk (Polymetaphenylene isophthalamide)

Polyaramid Disk offers exceptional tensile strength, heat resistance, and low weight in a precisely machined circular format. The material’s high-performance aromatic polyamide structure provides stability under thermal cycling and mechanical stress, while the disk geometry ensures consistent surface contact in gaskets, seals, and impact-resistant inserts. Industries including aerospace, defense, and automotive employ polyaramid disks in ballistic shielding components, heat-insulating barriers, and vibration-dampening systems. In research, they are used for studying composite bonding behavior, laser machining optimization, and thermal barrier coatings. The disk’s combination of dimensional accuracy, inherent flame resistance, and lightweight strength ensures dependable performance in both high-specification engineering systems and advanced experimental setups.
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Tolerances

Disc
Thickness ±20%

Material Properties for Polymers

Chemical Resistance
Element Value
Acids - concentrated Poor
Acids - dilute Good-Fair
Alcohols Good
Alkalis Good-Poor
Aromatic hydrocarbons Good
Greases and Oils Good
Halogenated Hydrocarbons Good
Ketones Good
Electrical Properties
Element Value
Dielectric constant @1kHz 2.3
Dielectric strength( kV mm⁻¹ ) 32
Volume resistivity( Ohmcm ) 6x10¹⁶
Physical Properties
Element Value
Radiation resistance Good
Limiting oxygen index( % ) 29
Water absorption - equilibrium( % ) 9
Water absorption - over 24 hours( % ) 0.08
Density( gcm⁻³ ) 1.38
Mechanical Properties
Element Value
Elongation at break( % ) 9
Izod impact strength( J m⁻¹ ) 533unnotched
Tensile strength( MPa ) 1800-3900
Thermal Properties
Element Value
Heat-deflection temperature - 1.8MPa( C ) 149
Upper working temperature( C ) 200-300
Specific heat( J K⁻¹ kg⁻¹ ) 1200
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.13@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 20

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