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Composition: Mo
Form: Sputtering Target
Material: Molybdenum
CAS Number: 7439-98-7
Commodity: Metals
Molybdenum Sputtering Target delivers high purity, excellent thermal stability, and superior conductivity in a dense, uniform form engineered for thin-film deposition. Its resistance to oxidation and ability to withstand repeated plasma exposure make it essential for semiconductor, optics, and display technologies. Industries employ these targets in producing barrier layers for integrated circuits, coatings for thin-film transistors, and optical layers for advanced mirrors. Specific applications include thin films for photovoltaic cells, passivation layers in microelectronics, and wear-resistant coatings in aerospace systems. Research investigates molybdenum sputtering targets in nanostructured film growth, interface engineering, and high-performance conductive coatings. The sputtering target format ensures consistent film quality, precise stoichiometry, and reproducible deposition, reinforcing its value as a critical material in both industrial-scale device fabrication and experimental thin-film research.
Material Properties for Metals
Atomic Properties
| Element | Value |
|---|---|
| Atomic number | 42 |
| Crystal structure | Body centred cubic |
| Electronic structure | Kr 4d⁵ 5s¹ |
| Valences shown | 2, 3, 4, 5, 6 |
| Atomic weight( amu ) | 95.94 |
| Thermal neutron absorption cross-section( Barns ) | 2.65 |
| Photo-electric work function( eV ) | 4.2 |
| Natural isotope distribution( Mass No./% ) | 95/ 15.9 |
| Natural isotope distribution( Mass No./% ) | 96/ 16.7 |
| Natural isotope distribution( Mass No./% ) | 98/ 24.1 |
| Natural isotope distribution( Mass No./% ) | 97/ 9.6 |
| Natural isotope distribution( Mass No./% ) | 92/ 14.8 |
| Natural isotope distribution( Mass No./% ) | 94/ 9.3 |
| Natural isotope distribution( Mass No./% ) | 100/ 9.6 |
| Atomic radius - Goldschmidt( nm ) | 0.14 |
| Ionisation potential( No./eV ) | 2/ 16.15 |
| Ionisation potential( No./eV ) | 5/ 61.2 |
| Ionisation potential( No./eV ) | 68 |
| Ionisation potential( No./eV ) | 1/ 7.10 |
| Ionisation potential( No./eV ) | 3/ 27.2 |
| Ionisation potential( No./eV ) | 4/ 46.4 |
Mechanical Properties
| Element | Value |
|---|---|
| Material condition | Hard |
| Material condition | Soft |
| Poisson's ratio | 0.293 |
| Poisson's ratio | 0.293 |
| Bulk modulus( GPa ) | 261.2 |
| Bulk modulus( GPa ) | 261.2 |
| Tensile modulus( GPa ) | 324.8 |
| Tensile modulus( GPa ) | 324.8 |
| Hardness - Vickers( kgf mm⁻² ) | 250 |
| Hardness - Vickers( kgf mm⁻² ) | 200 |
| Tensile strength( MPa ) | 485-550 |
| Tensile strength( MPa ) | 620-690 |
| Yield strength( MPa ) | 550 |
| Yield strength( MPa ) | 415-450 |
Electrical Properties
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 5.7@20@20°C |
| Superconductivity critical temperature( K ) | 0.915 |
| Temperature coefficient( K⁻¹ ) | 0.00435@0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C)( mV ) | 1.45 |
Physical Properties
| Element | Value |
|---|---|
| Boiling point( C ) | 4612 |
| Density( gcm⁻³ ) | 10.22@20°C |
Thermal Properties
| Element | Value |
|---|---|
| Melting point( C ) | 2617 |
| Latent heat of evaporation( J g⁻¹ ) | 6153 |
| Latent heat of fusion( J g⁻¹ ) | 290 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 251@25°C |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 138@0-100°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 5.1@0-100°C |
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