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Molybdenum Sputtering Target

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Composition: Mo Form: Sputtering Target Material: Molybdenum CAS Number: 7439-98-7 Commodity: Metals
Molybdenum Sputtering Target delivers high purity, excellent thermal stability, and superior conductivity in a dense, uniform form engineered for thin-film deposition. Its resistance to oxidation and ability to withstand repeated plasma exposure make it essential for semiconductor, optics, and display technologies. Industries employ these targets in producing barrier layers for integrated circuits, coatings for thin-film transistors, and optical layers for advanced mirrors. Specific applications include thin films for photovoltaic cells, passivation layers in microelectronics, and wear-resistant coatings in aerospace systems. Research investigates molybdenum sputtering targets in nanostructured film growth, interface engineering, and high-performance conductive coatings. The sputtering target format ensures consistent film quality, precise stoichiometry, and reproducible deposition, reinforcing its value as a critical material in both industrial-scale device fabrication and experimental thin-film research.
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Material Properties

Atomic Properties
Element Value
Atomic number 42
Crystal structure Body centred cubic
Electronic structure Kr 4d⁵ 5s¹
Valences shown 2, 3, 4, 5, 6
Atomic weight( amu ) 95.94
Thermal neutron absorption cross-section( Barns ) 2.65
Photo-electric work function( eV ) 4.2
Natural isotope distribution( Mass No./% ) 95/ 15.9
Natural isotope distribution( Mass No./% ) 96/ 16.7
Natural isotope distribution( Mass No./% ) 98/ 24.1
Natural isotope distribution( Mass No./% ) 97/ 9.6
Natural isotope distribution( Mass No./% ) 92/ 14.8
Natural isotope distribution( Mass No./% ) 94/ 9.3
Natural isotope distribution( Mass No./% ) 100/ 9.6
Atomic radius - Goldschmidt( nm ) 0.14
Ionisation potential( No./eV ) 2/ 16.15
Ionisation potential( No./eV ) 5/ 61.2
Ionisation potential( No./eV ) 68
Ionisation potential( No./eV ) 1/ 7.10
Ionisation potential( No./eV ) 3/ 27.2
Ionisation potential( No./eV ) 4/ 46.4
Mechanical Properties
Element Value
Material condition Hard
Material condition Soft
Poisson's ratio 0.293
Poisson's ratio 0.293
Bulk modulus( GPa ) 261.2
Bulk modulus( GPa ) 261.2
Tensile modulus( GPa ) 324.8
Tensile modulus( GPa ) 324.8
Hardness - Vickers( kgf mm⁻² ) 250
Hardness - Vickers( kgf mm⁻² ) 200
Tensile strength( MPa ) 485-550
Tensile strength( MPa ) 620-690
Yield strength( MPa ) 550
Yield strength( MPa ) 415-450
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 5.7@20°C
Superconductivity critical temperature( K ) 0.915
Temperature coefficient( K⁻¹ ) 0.00435@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) 1.45
Physical Properties
Element Value
Boiling point( C ) 4612
Density( gcm⁻³ ) 10.22@20°C
Thermal Properties
Element Value
Melting point( C ) 2617
Latent heat of evaporation( J g⁻¹ ) 6153
Latent heat of fusion( J g⁻¹ ) 290
Specific heat( J K⁻¹ kg⁻¹ ) 251@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 138@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 5.1@0-100°C
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Available Configurations

Properties common to all products in this list

Composition: Mo Form: Sputtering Target Material: Molybdenum CAS Number: 7439-98-7 Commodity: Metals

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Tolerances

Disk
Thickness <0.01mm ±25%
Thickness =<0.05mm ±15%
Thickness >0.05mm ±10%
Diameter ±0.5mm