Grade 200 Copper Balls

Grade 200 Copper Balls are defined by their excellent electrical and thermal conductivity, good corrosion resistance, and high ductility, making them indispensable in precision components across high-technology sectors. Their pure copper composition allows efficient conduction and energy transfer, while their spherical form provides dimensional stability for mechanical and electronic applications. These copper balls are widely employed in electronics, aerospace, automotive, and renewable energy industries, where conductivity and durability are paramount. Specific uses include solder ball precursors in advanced electronic packaging, conductive elements in precision switches and connectors, and thermal management systems in aerospace and automotive devices. In research, Grade 200 Copper Balls play a vital role in studying microstructural effects on conductivity, optimizing solder ball formation, and advancing automated copper ball production methods. Their combination of high conductivity, structural precision, and versatile functionality ensures ongoing value in both scientific innovation and industrial manufacturing.

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Tolerance

Properties

Reference & Citations

each

Tolerances

Ball/Sphere

Diameter	Standard	±5%
Diameter	Precision	See Item

Material Properties for Metals

Atomic Properties

Element	Value
Atomic number	29
Crystal structure	Face centred cubic
Electronic structure	Ar 3d¹⁰ 4s¹
Valences shown	1, 2
Atomic weight( amu )	63.546
Thermal neutron absorption cross-section( Barns )	3.8
Photo-electric work function( eV )	4.5
Natural isotope distribution( Mass No./% )	65/ 30.8
Natural isotope distribution( Mass No./% )	63/ 69.2
Atomic radius - Goldschmidt( nm )	0.128
Ionisation potential( No./eV )	4/ 55.2
Ionisation potential( No./eV )	6/ 103
Ionisation potential( No./eV )	1/ 7.73
Ionisation potential( No./eV )	5/ 79.9
Ionisation potential( No./eV )	3/ 36.8
Ionisation potential( No./eV )	2/ 20.29

Mechanical Properties

Element	Value
Material condition	Soft
Material condition	Hard
Poisson's ratio	0.343
Poisson's ratio	0.343
Bulk modulus( GPa )	137.8
Bulk modulus( GPa )	137.8
Tensile modulus( GPa )	129.8
Tensile modulus( GPa )	129.8
Izod toughness( J m⁻¹ )	68
Izod toughness( J m⁻¹ )	58
Hardness - Vickers( kgf mm⁻² )	87
Hardness - Vickers( kgf mm⁻² )	49
Tensile strength( MPa )	314
Tensile strength( MPa )	224
Yield strength( MPa )	270
Yield strength( MPa )	54

Electrical Properties

Element	Value
Electrical resistivity( µOhmcm )	1.69@20@20°C
Temperature coefficient( K⁻¹ )	0.0043@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV )	0.76

Physical Properties

Element	Value
Boiling point( C )	2567
Density( gcm⁻³ )	8.96@20°C

Thermal Properties

Element	Value
Melting point( C )	1083
Latent heat of evaporation( J g⁻¹ )	4796
Latent heat of fusion( J g⁻¹ )	205
Specific heat( J K⁻¹ kg⁻¹ )	385@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )	401@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	17@0-100°C