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Formula: Cu
Form: Powder
Material: Copper
CAS Number: 7440-50-8
Commodity: Metals
Hazard Pictogram:
GHS09
Copper Spherical Powder is commonly used in additive manufacturing, specifically in 3D printing and powder metallurgy, where its uniform spherical shape enhances flowability and packing density. This makes it ideal for producing high-performance components in industries such as electronics, energy storage, and thermal management. It is especially valuable in developing conductive materials for printed circuit boards (PCBs), battery electrodes, and heat dissipation components. In laboratory settings, Copper Spherical Powder supports research in areas like catalytic processes, electromagnetic shielding, and advanced materials for automotive and aerospace applications. Its superior thermal and electrical conductivity is crucial for improving performance in next-generation devices.
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Hazardous to the environment
Tolerances
Powder
| Mean Particle Size | Nominal | |
|---|---|---|
| Minimum Particle Size | Nominal | |
| Maximum Particle Size | Nominal | |
| Maximum Particle Size | Nominal | |
| Particle Size D10 | Nominal | |
| Particle Size D50 | Nominal | |
| Particle Size D90 | Nominal |
Material Properties for Metals
Atomic Properties
| Element | Value |
|---|---|
| Atomic number | 29 |
| Crystal structure | Face centred cubic |
| Electronic structure | Ar 3d¹⁰ 4s¹ |
| Valences shown | 1, 2 |
| Atomic weight( amu ) | 63.546 |
| Thermal neutron absorption cross-section( Barns ) | 3.8 |
| Photo-electric work function( eV ) | 4.5 |
| Natural isotope distribution( Mass No./% ) | 65/ 30.8 |
| Natural isotope distribution( Mass No./% ) | 63/ 69.2 |
| Atomic radius - Goldschmidt( nm ) | 0.128 |
| Ionisation potential( No./eV ) | 4/ 55.2 |
| Ionisation potential( No./eV ) | 6/ 103 |
| Ionisation potential( No./eV ) | 1/ 7.73 |
| Ionisation potential( No./eV ) | 5/ 79.9 |
| Ionisation potential( No./eV ) | 3/ 36.8 |
| Ionisation potential( No./eV ) | 2/ 20.29 |
Mechanical Properties
| Element | Value |
|---|---|
| Material condition | Soft |
| Material condition | Hard |
| Poisson's ratio | 0.343 |
| Poisson's ratio | 0.343 |
| Bulk modulus( GPa ) | 137.8 |
| Bulk modulus( GPa ) | 137.8 |
| Tensile modulus( GPa ) | 129.8 |
| Tensile modulus( GPa ) | 129.8 |
| Izod toughness( J m⁻¹ ) | 68 |
| Izod toughness( J m⁻¹ ) | 58 |
| Hardness - Vickers( kgf mm⁻² ) | 87 |
| Hardness - Vickers( kgf mm⁻² ) | 49 |
| Tensile strength( MPa ) | 314 |
| Tensile strength( MPa ) | 224 |
| Yield strength( MPa ) | 270 |
| Yield strength( MPa ) | 54 |
Electrical Properties
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 1.69@20@20°C |
| Temperature coefficient( K⁻¹ ) | 0.0043@0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C)( mV ) | 0.76 |
Physical Properties
| Element | Value |
|---|---|
| Boiling point( C ) | 2567 |
| Density( gcm⁻³ ) | 8.96@20°C |
Thermal Properties
| Element | Value |
|---|---|
| Melting point( C ) | 1083 |
| Latent heat of evaporation( J g⁻¹ ) | 4796 |
| Latent heat of fusion( J g⁻¹ ) | 205 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 385@25°C |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 401@0-100°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 17@0-100°C |
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