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Copper Foam

Available Configurations

Properties common to all products in this list

Form: Foam Composition: Cu Material: Copper CAS Number: 7440-50-8 Commodity: Metals
Copper Foam is characterized by its highly porous structure and excellent electrical and thermal conductivity, enabling unique combinations of lightweight design with high functional performance. With porosities ranging from 63% to 94%, it offers substantial surface area, enhancing mass and heat transfer in both industrial and research applications. Copper foam is utilized across energy storage, catalysis, filtration, and advanced electronics industries. Specific uses include 3D porous electrodes for nonenzymatic glucose sensors, efficient oil–water separation media, and catalytic substrates for fuel cells, where its large surface area and conductivity improve efficiency and reaction kinetics. In research and innovation, copper foam supports the development of next-generation electrochemical systems, advanced heat exchangers, and multifunctional lightweight materials. Its versatility and high-performance attributes make it a critical enabler in modern engineering and scientific exploration.
Starting at $620.00 each
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Material Properties

Atomic Properties
Element Value
Atomic number 29
Crystal structure Face centred cubic
Electronic structure Ar 3d¹⁰ 4s¹
Valences shown 1, 2
Atomic weight( amu ) 63.546
Thermal neutron absorption cross-section( Barns ) 3.8
Photo-electric work function( eV ) 4.5
Natural isotope distribution( Mass No./% ) 65/ 30.8
Natural isotope distribution( Mass No./% ) 63/ 69.2
Atomic radius - Goldschmidt( nm ) 0.128
Ionisation potential( No./eV ) 4/ 55.2
Ionisation potential( No./eV ) 6/ 103
Ionisation potential( No./eV ) 1/ 7.73
Ionisation potential( No./eV ) 5/ 79.9
Ionisation potential( No./eV ) 3/ 36.8
Ionisation potential( No./eV ) 2/ 20.29
Mechanical Properties
Element Value
Material condition Soft
Material condition Hard
Poisson's ratio 0.343
Poisson's ratio 0.343
Bulk modulus( GPa ) 137.8
Bulk modulus( GPa ) 137.8
Tensile modulus( GPa ) 129.8
Tensile modulus( GPa ) 129.8
Izod toughness( J m⁻¹ ) 68
Izod toughness( J m⁻¹ ) 58
Hardness - Vickers( kgf mm⁻² ) 87
Hardness - Vickers( kgf mm⁻² ) 49
Tensile strength( MPa ) 314
Tensile strength( MPa ) 224
Yield strength( MPa ) 270
Yield strength( MPa ) 54
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 1.69@20°C
Temperature coefficient( K⁻¹ ) 0.0043@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) 0.76
Physical Properties
Element Value
Boiling point( C ) 2567
Density( gcm⁻³ ) 8.96@20°C
Thermal Properties
Element Value
Melting point( C ) 1083
Latent heat of evaporation( J g⁻¹ ) 4796
Latent heat of fusion( J g⁻¹ ) 205
Specific heat( J K⁻¹ kg⁻¹ ) 385@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 401@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 17@0-100°C
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Available Configurations

Properties common to all products in this list

Form: Foam Composition: Cu Material: Copper CAS Number: 7440-50-8 Commodity: Metals

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Tolerances

Sizes
Linear dimension Nominal

Tolerances

Sizes
Thickness Nominal
All Other All other dimesions are Nominal