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Grade: Additive Free Polymer
Formula: PS
Form: Disk
Material: Polystyrene (PS)
Commodity: Polymers
Thickness: 0.05mm
Structure: Biaxially Oriented
Transparency: Clear/Transparent

Additive Free Polymer Polystyrene Disk

Additive Free Polymer PS Disk is a pure polystyrene material offering excellent rigidity, optical clarity, and ease of thermoforming, without any stabilizers, pigments, or other additives. This ensures low extractable content, making it suitable for applications requiring high material purity and inertness. Packaging, biomedical, and electronics industries use such disks for transparent enclosures, sterile interfaces, and optically clear insulating components. Specific applications include low-contamination sample windows in spectroscopic instruments, optically clear spacers in biomedical diagnostic devices, and dielectric supports in sensitive electronics where purity and stability are essential. In research and innovation, additive-free PS disks support the study of surface functionalization, fabrication of optical devices with controlled refractive properties, and prototyping of medical-grade polymer components without interference from additives. Its combination of optical transparency, dimensional stability, and purity makes it a versatile choice in high-precision scientific and industrial applications.
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Tolerances

Disc
Thickness ±20%

Material Properties for Polymers

Physical Properties
Element Value
Abbe number 30.8
Flammability HB
Radiation resistance Good
Refractive index 1.59-1.6
Resistance to Ultra-violet Poor
Limiting oxygen index( % ) 19
Water absorption - over 24 hours( % ) 0.4
Density( gcm⁻³ ) 1.05
Chemical Resistance
Element Value
Acids - concentrated Fair-Poor
Acids - dilute Good-Fair
Alcohols Good-Fair
Alkalis Good-Fair
Aromatic hydrocarbons Poor
Greases and Oils Good-Poor
Halogenated Hydrocarbons Poor
Halogens Poor
Ketones Poor
Electrical Properties
Element Value
Dielectric constant @1MHz 2.4-3.1
Dissipation factor @ 1kHz 0.0002
Dielectric strength( kV mm⁻¹ ) 20
Volume resistivity( Ohmcm ) >10¹⁶
Mechanical Properties
Element Value
Hardness - Rockwell M60-90
Poisson's ratio 0.35
Elongation at break( % ) 1.6
Tensile modulus( GPa ) 2.3-4.1
Izod impact strength( J m⁻¹ ) 19-24
Tensile strength( MPa ) 30-100
Thermal Properties
Element Value
Heat-deflection temperature - 0.45MPa( C ) 90
Heat-deflection temperature - 1.8MPa( C ) 80
Upper working temperature( C ) 50-95
Specific heat( J K⁻¹ kg⁻¹ ) 1200
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.1-0.13@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 30-210

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