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Tungsten Thin Film Disk (Mylar® Backing)

Available Configurations

Properties common to all products in this list

Composition: W Form: Thin Film Material: Tungsten CAS Number: 7440-33-7 Commodity: Metals Purity: 99.95% Support: Permanent Mylar® 3.5µm
Tungsten Thin Film Disk combines the high density, hardness, and thermal conductivity of tungsten with a precision-machined disk format optimized for use as substrates, mirrors, or calibration standards in thin-film applications. Its geometry supports uniform thin-film growth, making it ideal for semiconductor research, high-power optics, and superconducting device fabrication. Specific uses include serving as a deposition substrate for multilayer coatings, functioning as calibration weights in precision balances, and acting as a heat spreader in laser assemblies. In research, tungsten thin film disks are integral for testing coating adhesion, evaluating thermal management strategies, and fabricating high-frequency electronic components. The form’s dimensional accuracy and surface quality, coupled with tungsten’s inherent stability, ensure performance in both experimental and production environments.
Starting at $1,130.00 each
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Material Properties

Atomic Properties
Element Value
Atomic number 74
Crystal structure Body centred cubic
Electronic structure Xe 4f¹⁴ 5d⁴ 6s²
Valences shown 2,3,4,5,6
Atomic weight( amu ) 183.85
Thermal neutron absorption cross-section( Barns ) 18.5
Photo-electric work function( eV ) 4.55
Natural isotope distribution( Mass No./% ) 183/ 14.3
Natural isotope distribution( Mass No./% ) 182/ 26.3
Natural isotope distribution( Mass No./% ) 186/ 28.6
Natural isotope distribution( Mass No./% ) 180/ 0.1
Natural isotope distribution( Mass No./% ) 184/ 30.7
Atomic radius - Goldschmidt( nm ) 0.141
Ionisation potential( No./eV ) 1/ 7.98
Ionisation potential( No./eV ) 2/ 17.7
Mechanical Properties
Element Value
Material condition Soft
Material condition Hard
Poisson's ratio 0.28
Poisson's ratio 0.28
Bulk modulus( GPa ) 311
Bulk modulus( GPa ) 311
Tensile modulus( GPa ) 411
Tensile modulus( GPa ) 411
Hardness - Vickers( kgf mm⁻² ) 360
Hardness - Vickers( kgf mm⁻² ) 500
Tensile strength( MPa ) 550-620
Tensile strength( MPa ) 1920
Yield strength( MPa ) 550
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 5.4@20°C
Superconductivity critical temperature( K ) 0.0154
Temperature coefficient( K⁻¹ ) 0.0048@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) 1.12
Physical Properties
Element Value
Boiling point( C ) 5660
Density( gcm⁻³ ) 19.3@20°C
Thermal Properties
Element Value
Melting point( C ) 3410
Latent heat of evaporation( J g⁻¹ ) 4009
Latent heat of fusion( J g⁻¹ ) 192
Specific heat( J K⁻¹ kg⁻¹ ) 133@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 173@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 4.5@0-100°C
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Available Configurations

Properties common to all products in this list

Composition: W Form: Thin Film Material: Tungsten CAS Number: 7440-33-7 Commodity: Metals Purity: 99.95% Support: Permanent Mylar® 3.5µm

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Tolerances

Thin Film
Thickness ±30%

Tolerances

Disk
Diameter ±20%