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Grade: MX004
Formula: PMP TPX®
Form: Coil
Material: Polymethylpentene (PMP, TPX®)
Commodity: Polymers
Thickness: 0.05mm
Coil Width: 600mm
Surface Finish: Matt/Gloss
Color: Natural
MX004 PMP Coil embodies transparency, heat resistance, and chemical durability, optimized in a film/coil configuration. It maintains 94% light transmittance, low density, and low water absorption, while delivering thermal stability to approximately 170 °C. The grade also exhibits a low dielectric constant (~2.12) and outstanding insulation performance, with strong chemical resistance across acids, alkalis, and alcohols. Industries including microfluidics, biosensing, photonics research, and packaging deploy MX004 coils for optical components, cell-culture microdevices, and microwave-safe casings. The coil form is particularly suited to micro-optical film manufacturing, gas-permeable culture substrates, and transparent waveguide elements—where clarity, gas exchange, and sterilization matter. In advanced research, MX004 PMP Coil supports organ-on-chip prototypes, bioreactors, and lab-on-chip photonic devices, aiding precision oxygen delivery, optical sensing, and chemical robustness. As a lightweight, optically precise, and resilient film, MX004 PMP Coil is instrumental in pushing boundaries across biomedical, sensor, and optical engineering domains.
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Tolerances

Coil
Thickness ±20%

Material Properties for Polymers

Chemical Resistance
Element Value
Acids - concentrated Good-Fair
Acids - dilute Good
Alcohols Good
Alkalis Good
Aromatic hydrocarbons Fair-Poor
Greases and Oils Good-Fair
Halogenated Hydrocarbons Fair-Poor
Halogens Fair-Poor
Ketones Good-Fair
Electrical Properties
Element Value
Dielectric constant @1MHz 2.12
Dissipation factor @ 1kHz 0.0002
Volume resistivity( Ohmcm ) >10¹⁶
Physical Properties
Element Value
Flammability HB
Refractive index 1.463
Resistance to Ultra-violet Poor
Limiting oxygen index( % ) 17
Water absorption - over 24 hours( % ) 0.01
Density( gcm⁻³ ) 0.835
Mechanical Properties
Element Value
Hardness - Rockwell R85
Elongation at break( % ) 15
Tensile modulus( GPa ) 1.5
Izod impact strength( J m⁻¹ ) 49
Tensile strength( MPa ) 25.5
Thermal Properties
Element Value
Heat-deflection temperature - 0.45MPa( C ) 100
Heat-deflection temperature - 1.8MPa( C ) 40
Lower working temperature( C ) 20
Upper working temperature( C ) 75-115
Specific heat( J K⁻¹ kg⁻¹ ) 2000
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.17@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 117

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