MX002 PMP Coil

MX002 PMP Coil delivers a unique set of properties: low density, excellent transparency, and long-term heat resistance. Its clarity rivals that of glass or acrylic, while its low refractive index, gas permeability, and superior release characteristics make it exceptional for film and coating applications. The grade withstands high temperatures with a high melting point and maintains chemical and steam resistance across aggressive environments. Featuring low dielectric behavior and high insulation similar to fluorocarbon polymers, MX002 is particularly suited to applications in food packaging, release films for flexible circuits, laboratory apparatus, and hollow-fiber production. The coil form shines in release liners for microfabrication, gas-permeable packaging sheets, and transparent, sterilizable films used in biomedical research. Researchers and innovators benefit from MX002 PMP Coil’s combination of clarity, thermal stability, chemical resilience, and low surface tension—enabling breakthroughs in fields ranging from biosensing and optical devices to advanced packaging and microtechnology. In scientific and industrial contexts, MX002 PMP Coil stands as a lightweight, high-performance film that supports innovation under demanding conditions.

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Tolerance

Properties

Reference & Citations

each

Tolerances

Coil

Thickness		±20%

Material Properties for Polymers

Chemical Resistance

Element	Value
Acids - concentrated	Good-Fair
Acids - dilute	Good
Alcohols	Good
Alkalis	Good
Aromatic hydrocarbons	Fair-Poor
Greases and Oils	Good-Fair
Halogenated Hydrocarbons	Fair-Poor
Halogens	Fair-Poor
Ketones	Good-Fair

Electrical Properties

Element	Value
Dielectric constant @1MHz	2.12
Dissipation factor @ 1kHz	0.0002
Volume resistivity( Ohmcm )	>10¹⁶

Physical Properties

Element	Value
Flammability	HB
Refractive index	1.463
Resistance to Ultra-violet	Poor
Limiting oxygen index( % )	17
Water absorption - over 24 hours( % )	0.01
Density( gcm⁻³ )	0.835

Mechanical Properties

Element	Value
Hardness - Rockwell	R85
Elongation at break( % )	15
Tensile modulus( GPa )	1.5
Izod impact strength( J m⁻¹ )	49
Tensile strength( MPa )	25.5

Thermal Properties

Element	Value
Heat-deflection temperature - 0.45MPa( C )	100
Heat-deflection temperature - 1.8MPa( C )	40
Lower working temperature( C )	20
Upper working temperature( C )	75-115
Specific heat( J K⁻¹ kg⁻¹ )	2000
Thermal conductivity( W m⁻¹ K⁻¹ )	0.17@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	117