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Grade: DX845
Formula: PMP TPX®
Form: Coil
Material: Polymethylpentene (PMP, TPX®)
Commodity: Polymers
Surface Finish: Matt/Gloss
Color: Natural
DX845 PMP Coil offers an unmatched combination of ultra‑low density (~0.833 g/cm³), high thermal resistance, and outstanding electrical insulation. With a melting point near 235–240 °C and minimal water absorption, it ensures dimensional stability under heat and moisture. Optically transparent with low haze (~1.1 %) and a steady refractive index (~1.46), the film form maintains clarity across a broad spectrum. Its low dielectric constant (~2.1) and high volume resistivity (~10¹⁶ Ω·cm) make it ideal for high‑frequency and microwave insulation applications. Industries such as medical diagnostics, electronics manufacturing, and advanced packaging benefit from its film‑grade properties. In biomedical and lab contexts, DX845 PMP Coil serves as autoclavable, transparent film for sterile packaging or diagnostic windows. In electronics, it excels as a high‑temperature, non‑stick release layer for flexible circuits. In packaging, its clarity and steam resistance support microwave‑safe, gas‑permeable wraps. Its unique property set empowers research across optics, sensor systems, and high‑frequency device fabrication. Ultimately, DX845 PMP Coil is a lightweight, high‑clarity polymer film material that delivers reliability and versatility for scientific innovation and industrial applications.
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Tolerances

Coil
Thickness ±20%

Material Properties for Polymers

Chemical Resistance
Element Value
Acids - concentrated Good-Fair
Acids - dilute Good
Alcohols Good
Alkalis Good
Aromatic hydrocarbons Fair-Poor
Greases and Oils Good-Fair
Halogenated Hydrocarbons Fair-Poor
Halogens Fair-Poor
Ketones Good-Fair
Electrical Properties
Element Value
Dielectric constant @1MHz 2.12
Dissipation factor @ 1kHz 0.0002
Volume resistivity( Ohmcm ) >10¹⁶
Physical Properties
Element Value
Flammability HB
Refractive index 1.463
Resistance to Ultra-violet Poor
Limiting oxygen index( % ) 17
Water absorption - over 24 hours( % ) 0.01
Density( gcm⁻³ ) 0.835
Mechanical Properties
Element Value
Hardness - Rockwell R85
Elongation at break( % ) 15
Tensile modulus( GPa ) 1.5
Izod impact strength( J m⁻¹ ) 49
Tensile strength( MPa ) 25.5
Thermal Properties
Element Value
Heat-deflection temperature - 0.45MPa( C ) 100
Heat-deflection temperature - 1.8MPa( C ) 40
Lower working temperature( C ) 20
Upper working temperature( C ) 75-115
Specific heat( J K⁻¹ kg⁻¹ ) 2000
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.17@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 117

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